
AMD Xilinx
XC6VHX565T-2FF1924I
XC6VHX565T-2FF1924I ECAD Model
XC6VHX565T-2FF1924I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 640 | |
Number of Outputs | 640 | |
Number of Logic Cells | 566784 | |
Combinatorial Delay of a CLB-Max | 4.29 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Clock Frequency-Max | 1.286 GHz | |
Power Supplies | 1,1.2/2.5 V | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B1924 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1924 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1924,44X44,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 45 mm | |
Length | 45 mm | |
Seated Height-Max | 3.85 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | FBGA-1924 | |
Pin Count | 1924 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC6VHX565T-2FF1924I Datasheet Download
XC6VHX565T-2FF1924I Overview
The XC6VHX565T-2FF1924I chip model is a high-performance, low-power integrated circuit developed by Xilinx, Inc. It is based on the Xilinx Virtex-6 FPGA family and offers a wide range of features. The chip model is well-suited for a wide range of applications, including data processing, signal processing, image processing, and communications.
The XC6VHX565T-2FF1924I chip model has several advantages. It is highly configurable, allowing users to customize their designs to meet their specific needs. It also has a high level of integration, allowing for a smaller form factor and lower power consumption. Furthermore, the chip model has a wide range of features, including high-speed transceivers, high-speed memory interfaces, and high-speed clock management.
The XC6VHX565T-2FF1924I chip model is expected to see a growing demand in the coming years. With the rapid growth of the Internet of Things (IoT), the demand for low-power, high-performance chips is expected to rise. Furthermore, with the increasing demand for intelligent systems, the chip model is likely to find many applications in the future.
The XC6VHX565T-2FF1924I chip model has a product description and specific design requirements that must be met for successful implementation. The chip model is designed for high-speed transceivers, high-speed memory interfaces, and high-speed clock management, and it must be able to support a wide range of data rates and protocols. Furthermore, the chip model must be able to handle high voltage levels and temperatures, as well as be able to withstand harsh environmental conditions.
There are several case studies that demonstrate the successful implementation of the XC6VHX565T-2FF1924I chip model. For example, the chip model was used in a network switch to provide high-speed data transmission with low latency. Furthermore, the chip model was used in a wireless communication system to provide reliable data transmission with low power consumption. These case studies demonstrate the chip model's ability to meet the design requirements for a wide range of applications.
Finally, there are several precautions that must be taken when using the XC6VHX565T-2FF1924I chip model. The chip model is sensitive to temperature, and it must be operated within its specified temperature range. Furthermore, the chip model must be operated within its specified voltage range, and it must be properly grounded to prevent damage. Finally, the chip model must be handled with care to avoid damage.
In conclusion, the XC6VHX565T-2FF1924I chip model is a high-performance, low-power integrated circuit developed by Xilinx, Inc. It has several advantages, including high configurability, high integration, and a wide range of features. The chip model is expected to see a growing demand in the coming years, and it is likely to find many applications in the future. Furthermore, the chip model has a product description and specific design requirements that must be met for successful implementation. Finally, there are several case studies and precautions that must be taken when using the chip model.
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