XC6VHX565T-2FF1924I
XC6VHX565T-2FF1924I
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rohs

AMD Xilinx

XC6VHX565T-2FF1924I


XC6VHX565T-2FF1924I
F20-XC6VHX565T-2FF1924I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-1924
FBGA-1924

XC6VHX565T-2FF1924I ECAD Model


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XC6VHX565T-2FF1924I Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1 V
Number of Inputs 640
Number of Outputs 640
Number of Logic Cells 566784
Combinatorial Delay of a CLB-Max 4.29 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 1.286 GHz
Power Supplies 1,1.2/2.5 V
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B1924
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1924
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1924,44X44,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 45 mm
Length 45 mm
Seated Height-Max 3.85 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description FBGA-1924
Pin Count 1924
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XC6VHX565T-2FF1924I Datasheet Download


XC6VHX565T-2FF1924I Overview



The XC6VHX565T-2FF1924I chip model is a high-performance, low-power integrated circuit developed by Xilinx, Inc. It is based on the Xilinx Virtex-6 FPGA family and offers a wide range of features. The chip model is well-suited for a wide range of applications, including data processing, signal processing, image processing, and communications.


The XC6VHX565T-2FF1924I chip model has several advantages. It is highly configurable, allowing users to customize their designs to meet their specific needs. It also has a high level of integration, allowing for a smaller form factor and lower power consumption. Furthermore, the chip model has a wide range of features, including high-speed transceivers, high-speed memory interfaces, and high-speed clock management.


The XC6VHX565T-2FF1924I chip model is expected to see a growing demand in the coming years. With the rapid growth of the Internet of Things (IoT), the demand for low-power, high-performance chips is expected to rise. Furthermore, with the increasing demand for intelligent systems, the chip model is likely to find many applications in the future.


The XC6VHX565T-2FF1924I chip model has a product description and specific design requirements that must be met for successful implementation. The chip model is designed for high-speed transceivers, high-speed memory interfaces, and high-speed clock management, and it must be able to support a wide range of data rates and protocols. Furthermore, the chip model must be able to handle high voltage levels and temperatures, as well as be able to withstand harsh environmental conditions.


There are several case studies that demonstrate the successful implementation of the XC6VHX565T-2FF1924I chip model. For example, the chip model was used in a network switch to provide high-speed data transmission with low latency. Furthermore, the chip model was used in a wireless communication system to provide reliable data transmission with low power consumption. These case studies demonstrate the chip model's ability to meet the design requirements for a wide range of applications.


Finally, there are several precautions that must be taken when using the XC6VHX565T-2FF1924I chip model. The chip model is sensitive to temperature, and it must be operated within its specified temperature range. Furthermore, the chip model must be operated within its specified voltage range, and it must be properly grounded to prevent damage. Finally, the chip model must be handled with care to avoid damage.


In conclusion, the XC6VHX565T-2FF1924I chip model is a high-performance, low-power integrated circuit developed by Xilinx, Inc. It has several advantages, including high configurability, high integration, and a wide range of features. The chip model is expected to see a growing demand in the coming years, and it is likely to find many applications in the future. Furthermore, the chip model has a product description and specific design requirements that must be met for successful implementation. Finally, there are several case studies and precautions that must be taken when using the chip model.



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