AMD Xilinx
XC6VHX565T-1FF1924C
XC6VHX565T-1FF1924C ECAD Model
XC6VHX565T-1FF1924C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 640 | |
| Number of Outputs | 640 | |
| Number of Logic Cells | 566784 | |
| Combinatorial Delay of a CLB-Max | 5.08 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1924 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1924 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1924,44X44,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 3.85 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-1924 | |
| Pin Count | 1924 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC6VHX565T-1FF1924C Datasheet Download
XC6VHX565T-1FF1924C Overview
The XC6VHX565T-1FF1924C chip model is a high-performance and cost-effective solution for digital signal processing, embedded processing, and image processing. It is designed to be programmed using HDL language, which is a hardware description language that enables the creation of complex digital circuits and systems. This chip model is capable of providing an efficient and reliable performance, making it suitable for a wide variety of applications.
The XC6VHX565T-1FF1924C chip model is designed to meet the industry trends of the future. It is capable of supporting new technologies and applications, allowing for more efficient and reliable performance. The chip model is also designed to be compatible with a variety of platforms, making it a versatile and flexible solution for many different applications.
The product description and specific design requirements of the XC6VHX565T-1FF1924C chip model are detailed in the product documentation. This includes information regarding the chip's features and capabilities, as well as any specific design requirements. Additionally, actual case studies and examples of the chip model's usage can be found in the documentation.
When using the XC6VHX565T-1FF1924C chip model, it is important to consider the specific application requirements and design constraints. This includes the performance requirements of the application, as well as any specific hardware or software requirements. Additionally, it is important to consider any safety and security considerations, as well as any other potential risks associated with the use of the chip model.
In conclusion, the XC6VHX565T-1FF1924C chip model is a high-performance and cost-effective solution for digital signal processing, embedded processing, and image processing. It is designed to be programmed using HDL language, and is capable of providing an efficient and reliable performance. The product description and design requirements are detailed in the product documentation, and it is important to consider the application requirements and design constraints when using the chip model.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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