AMD Xilinx
XC6VHX565T-1FF1923C
XC6VHX565T-1FF1923C ECAD Model
XC6VHX565T-1FF1923C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 720 | |
| Number of Outputs | 720 | |
| Number of Logic Cells | 566784 | |
| Combinatorial Delay of a CLB-Max | 5.08 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1924 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 1924 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1923,44X44,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 3.85 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-1924 | |
| Pin Count | 1924 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.A | |
| HTS Code | 8542.39.00.01 |
XC6VHX565T-1FF1923C Datasheet Download
XC6VHX565T-1FF1923C Overview
The XC6VHX565T-1FF1923C is a cutting-edge chip model that is designed to meet the needs of a wide range of applications, including high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language and offers a number of advantages over other chip models.
The XC6VHX565T-1FF1923C has a high level of performance, with a low power consumption and a wide range of features. It has a large memory capacity, allowing it to process large amounts of data quickly and efficiently. The chip also has a high degree of scalability, allowing it to be used in different applications. Additionally, it has a high level of reliability, making it suitable for use in a variety of industries.
The XC6VHX565T-1FF1923C is expected to be in high demand in the future, as the need for high-performance chips that can handle complex tasks increases. This chip model is also expected to be used in a wide range of industries, including industrial automation, automotive, and aerospace.
In order to design a product using the XC6VHX565T-1FF1923C, designers must ensure that they understand the chip's specific design requirements. This includes understanding the chip's memory capacity, power consumption, and scalability. Additionally, designers must also consider the chip's specific features, such as its data processing speed and reliability.
Case studies of products designed using the XC6VHX565T-1FF1923C have been conducted, which can provide a better understanding of the chip's capabilities. Additionally, designers should be aware of any potential issues that may arise when using the chip, such as power consumption or overheating. By understanding the chip's design requirements and potential issues, designers can ensure that their product is designed correctly and safely.
Overall, the XC6VHX565T-1FF1923C is a powerful and reliable chip model that is suitable for a wide range of applications. It has a high level of performance, reliability, and scalability, making it an ideal choice for a variety of industries. By understanding the chip's design requirements and potential issues, designers can ensure that their product is designed correctly and safely.
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| QTY | Unit Price | Ext Price |
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