
AMD Xilinx
XC6VHX380T-3FFG1924C
XC6VHX380T-3FFG1924C ECAD Model
XC6VHX380T-3FFG1924C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Number of Inputs | 640 | |
Number of Outputs | 640 | |
Number of Logic Cells | 382464 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Clock Frequency-Max | 1.412 GHz | |
Power Supplies | 1,1.2/2.5 V | |
JESD-30 Code | S-PBGA-B1924 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1924 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1924,44X44,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A001.A.7.B | |
HTS Code | 8542.39.00.01 |
XC6VHX380T-3FFG1924C Datasheet Download
XC6VHX380T-3FFG1924C Overview
The XC6VHX380T-3FFG1924C chip model is a high-performance, low-cost integrated circuit from Xilinx, Inc. It is designed for a wide range of applications, from embedded systems to high-performance computing. The chip model features advanced logic, memory, and connectivity capabilities, making it suitable for a variety of applications.
The XC6VHX380T-3FFG1924C chip model has several advantages over other chip models. It has a high-performance processor, which is capable of executing multiple instructions simultaneously. It also has a large memory capacity and a wide range of connectivity options, allowing it to be used in a variety of applications. Additionally, the chip is designed to be cost-effective, making it an attractive option for many businesses.
Given the advantages of the XC6VHX380T-3FFG1924C chip model, it is expected to be in high demand in the future. It is likely to be used in a variety of applications, such as embedded systems, high-performance computing, and network applications. In particular, the chip is likely to be used in many intelligent scenarios, such as autonomous vehicles, smart homes, and robotics. With its advanced logic, memory, and connectivity capabilities, the chip is well-suited for these types of applications.
The XC6VHX380T-3FFG1924C chip model has a number of specific design requirements. It has a power supply voltage range of 1.2V to 3.3V, and a temperature range of -40°C to +85°C. It also has an operating frequency of up to 800MHz, and a maximum operating temperature of 125°C. Additionally, the chip has a number of I/O pins, which can be used for connecting to other components.
There are several case studies demonstrating the capabilities of the XC6VHX380T-3FFG1924C chip model. For example, it has been used in an autonomous vehicle application, where it was used to control the vehicle's speed and direction. Additionally, it has been used to control a robotic arm, allowing it to accurately pick up and move objects.
When using the XC6VHX380T-3FFG1924C chip model, there are a few precautions to take. It is important to ensure that the chip is properly cooled, as it can become damaged if it is exposed to high temperatures. Additionally, it is important to ensure that the chip is properly powered, as it can become damaged if it is exposed to a voltage that is too low or too high.
In conclusion, the XC6VHX380T-3FFG1924C chip model is a high-performance, low-cost integrated circuit from Xilinx, Inc. It has a number of advantages, such as a high-performance processor, large memory capacity, and wide range of connectivity options. It is expected to be in high demand in the future, as it is suitable for a variety of applications, including embedded systems, high-performance computing, and network applications. Additionally, it has a number of specific design requirements, and there are several case studies demonstrating its capabilities. When using the chip, it is important to ensure that it is properly cooled and powered.
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