XC6VHX380T-3FF1923I
XC6VHX380T-3FF1923I
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XC6VHX380T-3FF1923I


XC6VHX380T-3FF1923I
F20-XC6VHX380T-3FF1923I
Active
FIELD PROGRAMMABLE GATE ARRAY
BGA

XC6VHX380T-3FF1923I ECAD Model


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XC6VHX380T-3FF1923I Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Active
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
JESD-609 Code e0
Terminal Finish TIN LEAD
Ihs Manufacturer XILINX INC
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XC6VHX380T-3FF1923I Datasheet Download


XC6VHX380T-3FF1923I Overview



The XC6VHX380T-3FF1923I chip model is a high-performance digital signal processing, embedded processing and image processing device, which requires the use of HDL language. It has the advantages of high speed, low power consumption, and high integration, making it suitable for a variety of applications.


The XC6VHX380T-3FF1923I chip model is designed for high-performance applications, such as digital signal processing, embedded processing, and image processing. It is capable of performing complex tasks in a short amount of time, and its low power consumption makes it an ideal choice for applications that require long-term operation. The chip model also has high integration, meaning it can be used to reduce the size and cost of a device.


In terms of future development, the XC6VHX380T-3FF1923I chip model is expected to remain in demand in related industries as more applications require its capabilities. It is likely that the chip model will need to be supported by new technologies in order to keep up with the latest trends in the industry, such as the development of 5G networks or the IoT.


The XC6VHX380T-3FF1923I chip model offers a wide range of advantages, from its high speed and low power consumption to its high integration. This makes it an ideal choice for applications that require high performance, as well as those that require long-term operation. As the industry continues to evolve, the chip model is expected to remain in demand, as more applications require its capabilities. It is likely that the chip model will need to be supported by new technologies in order to keep up with the latest trends in the industry.



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