
AMD Xilinx
XC6VHX380T-2FF1924I
XC6VHX380T-2FF1924I ECAD Model
XC6VHX380T-2FF1924I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 640 | |
Number of Outputs | 640 | |
Number of Logic Cells | 382464 | |
Combinatorial Delay of a CLB-Max | 4.29 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Clock Frequency-Max | 1.286 GHz | |
Power Supplies | 1,1.2/2.5 V | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B1924 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1924 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1924,44X44,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 45 mm | |
Length | 45 mm | |
Seated Height-Max | 3.85 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | FBGA-1924 | |
Pin Count | 1924 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A001.A.7.B | |
HTS Code | 8542.39.00.01 |
XC6VHX380T-2FF1924I Datasheet Download
XC6VHX380T-2FF1924I Overview
The XC6VHX380T-2FF1924I chip model is a powerful and versatile processor used for high-performance digital signal processing, embedded processing, and image processing. It is designed to support the use of HDL language and is widely used in a variety of industries.
The chip model is capable of handling complex tasks with a high level of accuracy and speed. It is an ideal choice for applications that require high-speed data processing, such as image processing, embedded systems, and digital signal processing. It is also used in advanced communication systems due to its ability to process data quickly and accurately.
The chip model is designed to be easily upgradable and can be used in a variety of applications. It is designed to be able to handle the most advanced technologies and is capable of handling complex tasks with a high level of accuracy and speed. It is also designed to be able to handle new technologies as they become available.
The chip model is also designed to be able to handle future upgrades and can be used in a variety of advanced communication systems. It is designed to be able to handle the latest technologies and can be used in a variety of applications. It is also designed to be able to handle new technologies as they become available.
The chip model is a versatile and powerful processor with a variety of applications. It is designed to be able to handle the most advanced technologies and is capable of handling complex tasks with a high level of accuracy and speed. It is also designed to be able to handle future upgrades and can be used in a variety of advanced communication systems. It is an ideal choice for applications that require high-speed data processing, such as image processing, embedded systems, and digital signal processing.
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2,784 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $10,899.9943 | $10,899.9943 |
10+ | $10,782.7901 | $107,827.9008 |
100+ | $10,196.7689 | $1,019,676.8880 |
1000+ | $9,610.7477 | $4,805,373.8400 |
10000+ | $8,790.3180 | $8,790,318.0000 |
The price is for reference only, please refer to the actual quotation! |