AMD Xilinx
XC6VHX380T-2FF1924C
XC6VHX380T-2FF1924C ECAD Model
XC6VHX380T-2FF1924C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 640 | |
| Number of Outputs | 640 | |
| Number of Logic Cells | 382464 | |
| Combinatorial Delay of a CLB-Max | 4.29 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.286 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1924 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1924 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1924,44X44,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 3.85 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-1924 | |
| Pin Count | 1924 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.B | |
| HTS Code | 8542.39.00.01 |
XC6VHX380T-2FF1924C Datasheet Download
XC6VHX380T-2FF1924C Overview
The XC6VHX380T-2FF1924C chip model is a highly versatile and powerful device designed for a range of applications. It is specifically designed for high-performance digital signal processing, embedded processing, image processing and other applications, and requires the use of HDL language. This chip model has the potential to be upgraded and applied to advanced communication systems, networks and intelligent scenarios.
The XC6VHX380T-2FF1924C chip model is a powerful and versatile device that can be used for a variety of applications. Its original design intention was to provide high-performance digital signal processing, embedded processing, image processing and other applications, and it requires the use of HDL language. This chip model is capable of being upgraded and applied to advanced communication systems, networks and intelligent scenarios.
This chip model is capable of being applied to a wide range of intelligent scenarios, such as artificial intelligence, machine learning, natural language processing, etc. In addition, it can also be used in the era of fully intelligent systems. Furthermore, this chip model has the potential to be upgraded and applied to advanced communication systems, networks and intelligent scenarios.
The XC6VHX380T-2FF1924C chip model is a powerful and versatile device with a great potential for future upgrades and applications. It is designed for a range of applications, including high-performance digital signal processing, embedded processing, image processing and other applications, and requires the use of HDL language. This chip model can be used in advanced communication systems, networks and intelligent scenarios, and is capable of being applied to a wide range of intelligent scenarios, such as artificial intelligence, machine learning, natural language processing, etc. It also has the potential to be used in the era of fully intelligent systems.
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3,796 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $7,785.8410 | $7,785.8410 |
| 10+ | $7,702.1222 | $77,021.2224 |
| 100+ | $7,283.5286 | $728,352.8640 |
| 1000+ | $6,864.9350 | $3,432,467.5200 |
| 10000+ | $6,278.9040 | $6,278,904.0000 |
| The price is for reference only, please refer to the actual quotation! | ||