
AMD Xilinx
XC6VHX380T-1FF1923I
XC6VHX380T-1FF1923I ECAD Model
XC6VHX380T-1FF1923I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 720 | |
Number of Outputs | 720 | |
Number of Logic Cells | 382464 | |
Combinatorial Delay of a CLB-Max | 5.08 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Clock Frequency-Max | 1.098 GHz | |
Power Supplies | 1,1.2/2.5 V | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B1924 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Number of Terminals | 1924 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1923,44X44,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 45 mm | |
Length | 45 mm | |
Seated Height-Max | 3.85 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | FBGA-1924 | |
Pin Count | 1924 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A001.A.7.A | |
HTS Code | 8542.39.00.01 |
XC6VHX380T-1FF1923I Datasheet Download
XC6VHX380T-1FF1923I Overview
The XC6VHX380T-1FF1923I chip model is a powerful tool for digital signal processing, embedded processing and image processing. It is designed to be used with the HDL language, which is a hardware description language that enables designers to create and configure digital circuits and systems. This chip model provides significant advantages over other models, including its high performance, low power consumption, and its ability to be used in a variety of applications.
The XC6VHX380T-1FF1923I chip model has already seen success in the digital signal processing, embedded processing and image processing industries, and it is expected to continue to be in high demand in the future. This chip model is ideal for applications that require high performance, such as networks and intelligent scenarios. It is also highly suitable for use in the era of fully intelligent systems, where its performance and power efficiency will be invaluable.
In the future, the XC6VHX380T-1FF1923I chip model will be used in a wide range of applications, including networks, intelligent scenarios, and fully intelligent systems. It is a powerful tool that can be used to create highly efficient systems with low power consumption. This chip model is also ideal for applications that require high performance, making it an ideal choice for digital signal processing, embedded processing, and image processing. As the demand for these applications continues to grow, the XC6VHX380T-1FF1923I chip model will remain a popular choice for designers and engineers.
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Pricing (USD)
QTY | Unit Price | Ext Price |
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