AMD Xilinx
XC6VHX380T-1FF1155I
XC6VHX380T-1FF1155I ECAD Model
XC6VHX380T-1FF1155I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 440 | |
| Number of Outputs | 440 | |
| Number of Logic Cells | 382464 | |
| Combinatorial Delay of a CLB-Max | 5.08 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1156 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1155,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-1156 | |
| Pin Count | 1156 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC6VHX380T-1FF1155I Datasheet Download
XC6VHX380T-1FF1155I Overview
The XC6VHX380T-1FF1155I chip model is a powerful new development in the semiconductor industry that has the potential to revolutionize many different industries. It is a cutting-edge model that is designed to provide high performance, low power consumption, and advanced features. The model is designed to be used in a wide variety of applications, from consumer electronics to industrial automation.
The XC6VHX380T-1FF1155I chip model has several advantages over other models. It is designed to be highly efficient, with low power consumption and a high level of performance. It also offers a wide range of features, including advanced communication protocols and powerful encryption capabilities. Additionally, it is designed to be highly scalable, allowing for easy upgrades and customization.
The demand for the XC6VHX380T-1FF1155I chip model is expected to increase in the coming years as more industries adopt the technology. It is expected to be used in a variety of applications, from consumer electronics to industrial automation. Additionally, it is expected to be used in the development of advanced communication systems, such as 5G networks and the Internet of Things (IoT).
The XC6VHX380T-1FF1155I chip model is also expected to be used in the development and popularization of future intelligent robots. The model is designed to provide the necessary hardware and software capabilities to enable robots to process and interpret data in real-time. Additionally, it is expected to be used to facilitate communication between robots and humans.
In order to use the XC6VHX380T-1FF1155I chip model effectively, it is necessary to have a strong understanding of the underlying technology. Those with a background in computer science, engineering, or other related fields will be best equipped to take advantage of the model's features and capabilities. Additionally, those with experience in programming, data analysis, and machine learning will be able to make the most of the model's capabilities.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||