XC6VHX380T-1FF1155C
XC6VHX380T-1FF1155C
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rohs

AMD Xilinx

XC6VHX380T-1FF1155C


XC6VHX380T-1FF1155C
F20-XC6VHX380T-1FF1155C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-1156
FBGA-1156

XC6VHX380T-1FF1155C ECAD Model


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XC6VHX380T-1FF1155C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1 V
Number of Inputs 440
Number of Outputs 440
Number of Logic Cells 382464
Combinatorial Delay of a CLB-Max 5.08 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 1.098 GHz
Power Supplies 1,1.2/2.5 V
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B1156
Qualification Status Not Qualified
JESD-609 Code e0
Operating Temperature-Max 85 °C
Number of Terminals 1156
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1155,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description FBGA-1156
Pin Count 1156
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC6VHX380T-1FF1155C Datasheet Download


XC6VHX380T-1FF1155C Overview



The XC6VHX380T-1FF1155C chip model is a powerful and versatile integrated circuit (IC) designed for a variety of applications. It is a member of the Xilinx 6-series family of FPGAs (Field Programmable Gate Arrays) and offers an impressive array of features and capabilities. The original design intention of the chip model was to provide a cost-effective, high-performance solution for advanced communication systems.


The XC6VHX380T-1FF1155C chip model is a high-density, low-power FPGA, with a total of 1,155 logic cells and a maximum operating frequency of 300 MHz. It has a wide range of I/O options, including LVDS, SSTL, LVCMOS, and PCIe, allowing for a wide range of applications. It also has a high-performance DSP block, allowing for the implementation of complex signal processing algorithms. The chip model also has a wide range of memory options, including SRAM, ROM, and Flash, allowing for the implementation of complex embedded designs.


The XC6VHX380T-1FF1155C chip model is also highly upgradeable, allowing users to add new features and capabilities as needed. It is also possible to upgrade the chip model to support more advanced communication systems, such as 5G, Wi-Fi, and Bluetooth. Additionally, the chip model can be used to develop and popularize future intelligent robots, as it has a wide range of features and capabilities that are necessary for the development of such robots.


In order to effectively use the XC6VHX380T-1FF1155C chip model, it is important to understand the product description and specific design requirements. Additionally, it is important to understand the actual case studies and precautions associated with the chip model. It is also important to have the necessary technical talents and skills to design, develop, and implement the chip model.


Overall, the XC6VHX380T-1FF1155C chip model is a powerful and versatile integrated circuit that can be used for a variety of applications. It is highly upgradeable, allowing users to add new features and capabilities as needed. Additionally, it can be used to develop and popularize future intelligent robots. In order to use the chip model effectively, it is important to understand the product description and specific design requirements, as well as the actual case studies and precautions associated with the chip model.



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Unit Price: $5,152.224
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QTY Unit Price Ext Price
1+ $4,791.5683 $4,791.5683
10+ $4,740.0461 $47,400.4608
100+ $4,482.4349 $448,243.4880
1000+ $4,224.8237 $2,112,411.8400
10000+ $3,864.1680 $3,864,168.0000
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