AMD Xilinx
XC6VHX380T-1FF1154I
XC6VHX380T-1FF1154I ECAD Model
XC6VHX380T-1FF1154I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 320 | |
| Number of Outputs | 320 | |
| Number of Logic Cells | 382464 | |
| Combinatorial Delay of a CLB-Max | 5.08 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1156 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1154,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-1156 | |
| Pin Count | 1156 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC6VHX380T-1FF1154I Datasheet Download
XC6VHX380T-1FF1154I Overview
The XC6VHX380T-1FF1154I chip model is a powerful tool for digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, which is a hardware description language that is used to describe the behavior of digital systems. This chip model is a great choice for high-performance applications that require the use of HDL language.
The industry trends of the chip model XC6VHX380T-1FF1154I and the future development of related industries depend on the specific technologies that are needed for the application environment. This chip model is designed to be highly customizable and can be adapted to a variety of different applications. The original design intention of the chip model is to provide a powerful tool for digital signal processing, embedded processing, and image processing.
The possibility of future upgrades and whether it can be applied to advanced communication systems are both possible with the XC6VHX380T-1FF1154I chip model. This chip model is designed to be highly customizable and can be adapted to a variety of different applications. It is also designed to be able to take advantage of the latest technologies, such as 5G and beyond, which will help to ensure that the chip model remains up to date with the latest industry trends.
Overall, the XC6VHX380T-1FF1154I chip model is a powerful tool for digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language and is highly customizable, allowing it to be adapted to a variety of different applications. It is also designed to be able to take advantage of the latest technologies, such as 5G and beyond, which will help to ensure that the chip model remains up to date with the latest industry trends. This chip model is a great choice for high-performance applications that require the use of HDL language.
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4,925 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $6,707.8296 | $6,707.8296 |
| 10+ | $6,635.7024 | $66,357.0240 |
| 100+ | $6,275.0664 | $627,506.6400 |
| 1000+ | $5,914.4304 | $2,957,215.2000 |
| 10000+ | $5,409.5400 | $5,409,540.0000 |
| The price is for reference only, please refer to the actual quotation! | ||