AMD Xilinx
XC6VHX255T-3FFG1923C
XC6VHX255T-3FFG1923C ECAD Model
XC6VHX255T-3FFG1923C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Number of Inputs | 480 | |
| Number of Outputs | 480 | |
| Number of Logic Cells | 253440 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.412 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| JESD-30 Code | S-PBGA-B1923 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1923 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1923,44X44,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.B | |
| HTS Code | 8542.39.00.01 |
XC6VHX255T-3FFG1923C Datasheet Download
XC6VHX255T-3FFG1923C Overview
The XC6VHX255T-3FFG1923C chip model is a powerful and versatile integrated circuit that is specifically designed for high-performance digital signal processing, embedded processing, image processing, and other applications. It is capable of delivering high-performance processing at a low power consumption level. This chip model is designed to be used with the HDL (Hardware Description Language) programming language, which enables the user to create complex and sophisticated circuit designs.
The XC6VHX255T-3FFG1923C chip model has many advantages. It is capable of delivering high-performance processing at a low power consumption level, which makes it ideal for a variety of applications. Additionally, its robust design allows for future upgrades and modifications, making it a great choice for advanced communication systems. The chip model is also highly reliable and efficient, making it a great choice for those looking for a long-term solution.
The demand for the XC6VHX255T-3FFG1923C chip model is expected to increase in the future. This is due to its wide range of applications and its ability to deliver high-performance processing at a low power consumption level. Additionally, its robust design and reliability make it a great choice for those looking for a long-term solution. As the demand for advanced communication systems continues to grow, the XC6VHX255T-3FFG1923C chip model is expected to become increasingly popular.
The original design intention of the XC6VHX255T-3FFG1923C chip model was to provide a powerful and versatile integrated circuit that was specifically designed for high-performance digital signal processing, embedded processing, image processing, and other applications. The chip model was designed to be used with the HDL programming language, which enables the user to create complex and sophisticated circuit designs. Additionally, the chip model is capable of delivering high-performance processing at a low power consumption level, making it ideal for a variety of applications. The chip model also has the potential to be upgraded and modified in the future, making it a great choice for advanced communication systems.
5,166 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||