AMD Xilinx
XC6VHX255T-3FFG1155C
XC6VHX255T-3FFG1155C ECAD Model
XC6VHX255T-3FFG1155C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Number of Inputs | 440 | |
| Number of Outputs | 440 | |
| Number of Logic Cells | 253440 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.412 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| JESD-30 Code | S-PBGA-B1155 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1155 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1155,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC6VHX255T-3FFG1155C Datasheet Download
XC6VHX255T-3FFG1155C Overview
The chip model XC6VHX255T-3FFG1155C is a new generation of integrated circuits developed by Xilinx, Inc. It is designed to provide high-performance, low-power, and cost-effective solutions for a wide range of applications. This model is an FPGA (field-programmable gate array) and utilizes a 3D stacked silicon interconnect technology to achieve a high level of integration. It also features a variety of advanced features, including high-speed transceivers, reconfigurable logic blocks, and embedded memory blocks.
The XC6VHX255T-3FFG1155C has already been widely adopted in the industry, and its popularity is expected to continue to grow in the future. This model is ideal for applications such as high-speed networking, video processing, and embedded systems. It is also suitable for use in the automotive, aerospace, and industrial automation industries. Additionally, its low-power consumption makes it an attractive choice for battery-powered devices.
The XC6VHX255T-3FFG1155C is expected to be used in a variety of intelligent scenarios in the future. This model is capable of supporting a wide range of technologies, including machine learning, artificial intelligence, and the Internet of Things. It can also be used in autonomous systems, such as driverless cars, drones, and robots. This model is also well-suited for use in fully intelligent systems, as it is capable of providing the necessary processing power for such systems.
In conclusion, the XC6VHX255T-3FFG1155C is a highly versatile and powerful chip model. It is already being used in a variety of industries and is expected to be even more widely adopted in the future. Its low-power consumption and ability to support a wide range of technologies make it an ideal choice for a variety of applications, including intelligent systems. With its increasing popularity, the XC6VHX255T-3FFG1155C is sure to be a key player in the future of the chip industry.
3,703 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||