AMD Xilinx
XC6VHX255T-3FF1155C
XC6VHX255T-3FF1155C ECAD Model
XC6VHX255T-3FF1155C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 440 | |
| Number of Outputs | 440 | |
| Number of Logic Cells | 253440 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.412 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1156 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1155,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-1156 | |
| Pin Count | 1156 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC6VHX255T-3FF1155C Datasheet Download
XC6VHX255T-3FF1155C Overview
The XC6VHX255T-3FF1155C chip model is a powerful, feature-rich model that is suitable for a wide range of applications, from high-performance digital signal processing and embedded processing to image processing. It is also capable of being used in the development and popularization of future intelligent robots.
The XC6VHX255T-3FF1155C chip model is a Field Programmable Gate Array (FPGA) that is designed to be used with the HDL (Hardware Description Language) language. This model features a high-performance, low-power architecture that is capable of handling complex tasks. It also features a wide range of I/O and memory options, making it ideal for a variety of applications.
The XC6VHX255T-3FF1155C chip model is designed to be used in high-performance digital signal processing, embedded processing, and image processing applications. It is capable of handling complex data processing tasks with ease, and its low-power architecture ensures that it runs efficiently. In addition, its wide range of I/O and memory options make it suitable for a variety of applications.
Case studies have shown that the XC6VHX255T-3FF1155C chip model is capable of being used in the development and popularization of future intelligent robots. Its low-power architecture and wide range of I/O and memory options make it an ideal choice for robot development.
When using the XC6VHX255T-3FF1155C chip model, it is important to be aware of the design requirements of the model. It is important to ensure that the model is used in accordance with its specifications, as this will ensure that it performs optimally. In addition, it is important to be aware of any safety and security measures that may be necessary when using the model.
To effectively use the XC6VHX255T-3FF1155C chip model, it is important to have a good understanding of HDL language and the design requirements of the model. Technical talents such as electrical engineers, computer engineers, and software engineers are necessary to ensure that the model is used correctly and safely.
In conclusion, the XC6VHX255T-3FF1155C chip model is a powerful, feature-rich model that is suitable for a wide range of applications, from high-performance digital signal processing and embedded processing to image processing. It is also capable of being used in the development and popularization of future intelligent robots. To use the model effectively, it is important to have a good understanding of HDL language and the design requirements of the model, and to have the necessary technical talents.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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