AMD Xilinx
XC6VHX255T-2FF1155C
XC6VHX255T-2FF1155C ECAD Model
XC6VHX255T-2FF1155C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 440 | |
| Number of Outputs | 440 | |
| Number of Logic Cells | 253440 | |
| Combinatorial Delay of a CLB-Max | 4.29 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.286 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1156 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1155,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-1156 | |
| Pin Count | 1156 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC6VHX255T-2FF1155C Datasheet Download
XC6VHX255T-2FF1155C Overview
The chip model XC6VHX255T-2FF1155C has become increasingly popular in the industry due to its high performance, low power consumption, and wide range of applications. It has been widely used in a variety of fields, such as communications, consumer electronics, automotive, industrial control, and medical. As the industry continues to develop, the chip model is expected to become even more useful and versatile.
In terms of industry trends, the chip model XC6VHX255T-2FF1155C is likely to be used in more complex and sophisticated applications. It can be used to develop new technologies and applications in the field of artificial intelligence, machine learning, and data analytics. Additionally, the chip model can be used to develop and popularize future intelligent robots. It can also be used to power networks and enable intelligent scenarios.
In terms of the application environment, the chip model XC6VHX255T-2FF1155C is capable of supporting new technologies that are required by the application environment. It can be used to develop and implement new technologies such as deep learning, natural language processing, and computer vision. Additionally, the chip model is capable of providing the necessary computing power for the development and implementation of new technologies.
In terms of the technical talents required to use the chip model effectively, the chip model requires skilled engineers and technicians who are well-versed in the latest technologies. These professionals should be able to understand the chip model and its capabilities, as well as be able to program and configure the chip model to meet the needs of the application environment. Additionally, they should be familiar with the various aspects of the chip model, such as the design, architecture, and programming.
In conclusion, the chip model XC6VHX255T-2FF1155C is a powerful and versatile chip model that can be used in a variety of applications. It is capable of supporting new technologies and can be used to develop and popularize future intelligent robots. It requires skilled engineers and technicians to use the chip model effectively. With its high performance, low power consumption, and wide range of applications, the chip model is expected to remain popular in the industry for many years to come.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||