XC6VHX255T-1FF1155I
XC6VHX255T-1FF1155I
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rohs

AMD Xilinx

XC6VHX255T-1FF1155I


XC6VHX255T-1FF1155I
F20-XC6VHX255T-1FF1155I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-1156
FBGA-1156

XC6VHX255T-1FF1155I ECAD Model


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XC6VHX255T-1FF1155I Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1 V
Number of Inputs 440
Number of Outputs 440
Number of Logic Cells 253440
Combinatorial Delay of a CLB-Max 5.08 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 1.098 GHz
Power Supplies 1,1.2/2.5 V
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B1156
Qualification Status Not Qualified
JESD-609 Code e0
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Number of Terminals 1156
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1155,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description FBGA-1156
Pin Count 1156
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC6VHX255T-1FF1155I Datasheet Download


XC6VHX255T-1FF1155I Overview



The XC6VHX255T-1FF1155I is a chip model developed by Xilinx, a leading provider of programmable solutions. It is a high-performance FPGA device that is ideal for applications requiring digital signal processing, embedded processing, image processing, and other complex tasks. It is designed to be used with the HDL (Hardware Description Language) to allow for the creation of custom designs that can be tailored to the specific needs of the user.


The XC6VHX255T-1FF1155I has a number of advantages that make it an attractive solution for a variety of applications. It includes a high-speed fabric architecture, which is capable of supporting up to 6.5 Tbps of bandwidth. It also includes a large number of I/O pins, allowing it to be used in a variety of configurations. Additionally, it offers an array of configurable logic blocks and memory blocks, allowing for the customization of designs.


The XC6VHX255T-1FF1155I is expected to become increasingly popular in the years to come. As the demand for high-performance digital signal processing and embedded processing continues to grow, the XC6VHX255T-1FF1155I is well-suited to meet the needs of these applications. Additionally, its ability to support a variety of I/O configurations makes it an ideal choice for applications requiring a high degree of flexibility.


In order to design a system using the XC6VHX255T-1FF1155I, it is important to have a thorough understanding of the device's features and capabilities. The product description for the chip provides detailed information on its specifications, including the number of I/O pins, the number of configurable logic blocks, and the number of memory blocks. Additionally, it is important to understand the HDL language in order to create custom designs for the chip.


Case studies can also be helpful when designing a system with the XC6VHX255T-1FF1155I. Examining how others have used the device can provide insight into the best ways to configure it for a particular application. Additionally, it is important to keep in mind that the chip is not designed for all applications. Careful consideration must be taken to ensure that the chip is suitable for the task at hand.


In conclusion, the XC6VHX255T-1FF1155I is a powerful device that is well-suited for applications requiring high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language to allow for the creation of custom designs. With its high-speed fabric architecture, array of configurable logic blocks, and large number of I/O pins, the XC6VHX255T-1FF1155I is expected to become increasingly popular in the years to come. When designing a system with the chip, it is important to understand its features and capabilities, as well as to examine case studies and take precautions to ensure that the chip is suitable for the task at hand.



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