XC6VCX75T-1FFG484C
XC6VCX75T-1FFG484C
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rohs

AMD Xilinx

XC6VCX75T-1FFG484C


XC6VCX75T-1FFG484C
F20-XC6VCX75T-1FFG484C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 23 X 23 MM, LEAD FREE, FBGA-484
23 X 23 MM, LEAD FREE, FBGA-484

XC6VCX75T-1FFG484C ECAD Model


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XC6VCX75T-1FFG484C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 1 V
Number of Inputs 240
Number of Outputs 240
Number of Logic Cells 74496
Number of CLBs 5820
Combinatorial Delay of a CLB-Max 790 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 1.098 GHz
Power Supplies 1,1.2/2.5,2.5 V
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B484
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 484
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA484,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 23 mm
Length 23 mm
Seated Height-Max 3 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 23 X 23 MM, LEAD FREE, FBGA-484
Pin Count 484
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC6VCX75T-1FFG484C Datasheet Download


XC6VCX75T-1FFG484C Overview



The XC6VCX75T-1FFG484C chip model is an advanced digital signal processing (DSP) device designed to meet the needs of high-performance embedded processing, image processing, and other applications. It is designed to be programmed using the HDL language, which is a hardware description language widely used in the industry for developing complex digital systems. The XC6VCX75T-1FFG484C chip model has several advantages over other models, such as its high performance, low power consumption, and low cost.


The XC6VCX75T-1FFG484C chip model is expected to experience strong demand in the near future as embedded systems become increasingly popular in a variety of industries. It is likely to be used in a variety of applications, from automotive systems to medical devices. It can also be used in networks, allowing for faster data transfer between devices. In addition, it can be used in intelligent scenarios, such as for controlling robots or other autonomous systems.


The XC6VCX75T-1FFG484C chip model has the potential to be used in the era of fully intelligent systems. It can be used to control complex systems, such as self-driving cars, autonomous robots, and even intelligent buildings. Furthermore, it can be used to create more efficient networks, allowing for faster data transfer between devices and more efficient use of resources. Finally, it can be used to create intelligent algorithms that can be used to make decisions and solve problems in a wide variety of industries.


The XC6VCX75T-1FFG484C chip model is a powerful and versatile device that is expected to experience strong demand in the near future. Its advantages, such as its high performance, low power consumption, and low cost, make it an ideal choice for a variety of applications. Furthermore, its potential to be used in the era of fully intelligent systems makes it an attractive option for those looking to create more efficient networks and intelligent algorithms. As such, the XC6VCX75T-1FFG484C chip model is likely to experience strong demand in the near future.



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Unit Price: $353.60
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Pricing (USD)

QTY Unit Price Ext Price
1+ $328.8480 $328.8480
10+ $325.3120 $3,253.1200
100+ $307.6320 $30,763.2000
1000+ $289.9520 $144,976.0000
10000+ $265.2000 $265,200.0000
The price is for reference only, please refer to the actual quotation!

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