
AMD Xilinx
XC6VCX75T-1FFG484C
XC6VCX75T-1FFG484C ECAD Model
XC6VCX75T-1FFG484C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 240 | |
Number of Outputs | 240 | |
Number of Logic Cells | 74496 | |
Number of CLBs | 5820 | |
Combinatorial Delay of a CLB-Max | 790 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Clock Frequency-Max | 1.098 GHz | |
Power Supplies | 1,1.2/2.5,2.5 V | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B484 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 484 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA484,22X22,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 23 mm | |
Length | 23 mm | |
Seated Height-Max | 3 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 23 X 23 MM, LEAD FREE, FBGA-484 | |
Pin Count | 484 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC6VCX75T-1FFG484C Datasheet Download
XC6VCX75T-1FFG484C Overview
The XC6VCX75T-1FFG484C chip model is an advanced digital signal processing (DSP) device designed to meet the needs of high-performance embedded processing, image processing, and other applications. It is designed to be programmed using the HDL language, which is a hardware description language widely used in the industry for developing complex digital systems. The XC6VCX75T-1FFG484C chip model has several advantages over other models, such as its high performance, low power consumption, and low cost.
The XC6VCX75T-1FFG484C chip model is expected to experience strong demand in the near future as embedded systems become increasingly popular in a variety of industries. It is likely to be used in a variety of applications, from automotive systems to medical devices. It can also be used in networks, allowing for faster data transfer between devices. In addition, it can be used in intelligent scenarios, such as for controlling robots or other autonomous systems.
The XC6VCX75T-1FFG484C chip model has the potential to be used in the era of fully intelligent systems. It can be used to control complex systems, such as self-driving cars, autonomous robots, and even intelligent buildings. Furthermore, it can be used to create more efficient networks, allowing for faster data transfer between devices and more efficient use of resources. Finally, it can be used to create intelligent algorithms that can be used to make decisions and solve problems in a wide variety of industries.
The XC6VCX75T-1FFG484C chip model is a powerful and versatile device that is expected to experience strong demand in the near future. Its advantages, such as its high performance, low power consumption, and low cost, make it an ideal choice for a variety of applications. Furthermore, its potential to be used in the era of fully intelligent systems makes it an attractive option for those looking to create more efficient networks and intelligent algorithms. As such, the XC6VCX75T-1FFG484C chip model is likely to experience strong demand in the near future.
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4,437 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $328.8480 | $328.8480 |
10+ | $325.3120 | $3,253.1200 |
100+ | $307.6320 | $30,763.2000 |
1000+ | $289.9520 | $144,976.0000 |
10000+ | $265.2000 | $265,200.0000 |
The price is for reference only, please refer to the actual quotation! |