AMD Xilinx
XC6VCX240T-2FFG784C
XC6VCX240T-2FFG784C ECAD Model
XC6VCX240T-2FFG784C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 400 | |
| Number of Outputs | 400 | |
| Number of Logic Cells | 241152 | |
| Number of CLBs | 18840 | |
| Combinatorial Delay of a CLB-Max | 910 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5,2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B784 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 784 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA784,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 29 X 29 MM, LEAD FREE, FBGA-784 | |
| Pin Count | 784 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC6VCX240T-2FFG784C Datasheet Download
XC6VCX240T-2FFG784C Overview
The Xilinx XC6VCX240T-2FFG784C chip model is a high-performance, low-power, FPGA-based integrated circuit designed for advanced communication systems. It is designed to provide superior performance and flexibility in a wide range of applications, including high-speed networking, signal processing, and embedded systems. With its advanced features, the chip model can be used to develop and popularize future intelligent robots.
The XC6VCX240T-2FFG784C chip model is specifically designed to meet the needs of advanced communication systems. It includes a high-performance, low-power Virtex-6 FPGA with an integrated transceiver for high-speed communication. The integrated transceiver is capable of providing up to 28 Gbps data transmission rate, allowing the XC6VCX240T-2FFG784C chip model to be used for high-speed, high-performance applications. The FPGA also includes a variety of memory and logic resources, including block RAM and DSP slices, which can be used to implement custom logic functions.
In addition, the XC6VCX240T-2FFG784C chip model is designed to be easily upgradable. It is built on an open platform and supports a variety of third-party development tools and IP cores, allowing users to customize their designs and upgrade them as needed. This makes the XC6VCX240T-2FFG784C chip model an ideal choice for advanced communication systems that require flexibility and scalability.
When using the XC6VCX240T-2FFG784C chip model, there are a few important considerations to keep in mind. First, the chip model is designed for advanced communication systems, so users should have a good understanding of the underlying communication protocols and architectures. Additionally, the chip model is designed for high-speed networking, so users should also have a good understanding of the different networking technologies and protocols. Finally, the chip model is designed for embedded systems, so users should have a good understanding of the different embedded programming languages and development tools.
In order to effectively use the XC6VCX240T-2FFG784C chip model for the development and popularization of future intelligent robots, users will need to have technical knowledge in the areas of communication protocols, networking technologies, embedded programming languages, and development tools. Additionally, users should have a good understanding of the underlying architecture of the chip model and the various components that make up the design. This will enable users to create custom designs that can be used to build and deploy advanced communication systems, as well as intelligent robots.
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3,095 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,092.9360 | $1,092.9360 |
| 10+ | $1,081.1840 | $10,811.8400 |
| 100+ | $1,022.4240 | $102,242.4000 |
| 1000+ | $963.6640 | $481,832.0000 |
| 10000+ | $881.4000 | $881,400.0000 |
| The price is for reference only, please refer to the actual quotation! | ||