AMD Xilinx
XC6VCX130T-2FFG784C
XC6VCX130T-2FFG784C ECAD Model
XC6VCX130T-2FFG784C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 400 | |
| Number of Outputs | 400 | |
| Number of Logic Cells | 128000 | |
| Number of CLBs | 10000 | |
| Combinatorial Delay of a CLB-Max | 910 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5,2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B784 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 784 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA784,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 29 X 29 MM, LEAD FREE, FBGA-784 | |
| Pin Count | 784 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC6VCX130T-2FFG784C Datasheet Download
XC6VCX130T-2FFG784C Overview
The XC6VCX130T-2FFG784C chip model is a powerful and versatile tool for high-performance digital signal processing, embedded processing, and image processing. It requires the use of the HDL language to program and configure the chip. This makes it an ideal choice for many applications.
The chip model is designed to be highly efficient and reliable. It has a low power consumption and is capable of running complex algorithms. Its advanced features and capabilities make it suitable for a variety of applications. This includes those that require advanced communication systems, such as 5G networks.
As for the industry trends and future development of the XC6VCX130T-2FFG784C chip model, it is likely that it will continue to evolve as technology advances. For example, as 5G networks become more widespread, the chip model may need to be updated to support the new technologies. This could include improved performance, increased data throughput, and more efficient power consumption.
The original design intention of the XC6VCX130T-2FFG784C chip model was to provide a powerful and reliable platform for high-performance digital signal processing, embedded processing, and image processing. It was also designed with the possibility of future upgrades in mind. This means that the chip model can be easily adapted to new technologies and applications as they become available.
In conclusion, the XC6VCX130T-2FFG784C chip model is a powerful and reliable tool for high-performance digital signal processing, embedded processing, and image processing. It is designed to be highly efficient and reliable, and can be upgraded to support new technologies as they become available. It is an ideal choice for many applications, including those that require advanced communication systems.
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2,146 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $655.7616 | $655.7616 |
| 10+ | $648.7104 | $6,487.1040 |
| 100+ | $613.4544 | $61,345.4400 |
| 1000+ | $578.1984 | $289,099.2000 |
| 10000+ | $528.8400 | $528,840.0000 |
| The price is for reference only, please refer to the actual quotation! | ||