AMD Xilinx
XC6VCX130T-2FFG484I
XC6VCX130T-2FFG484I ECAD Model
XC6VCX130T-2FFG484I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 240 | |
| Number of Outputs | 240 | |
| Number of Logic Cells | 128000 | |
| Number of CLBs | 10000 | |
| Combinatorial Delay of a CLB-Max | 910 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5,2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 3 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 23 X 23 MM, LEAD FREE, FBGA-484 | |
| Pin Count | 484 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC6VCX130T-2FFG484I Datasheet Download
XC6VCX130T-2FFG484I Overview
The chip model XC6VCX130T-2FFG484I is a high-performance field programmable gate array (FPGA) developed by Xilinx. It is designed to provide high-performance digital signal processing, embedded processing, and image processing capabilities. It is also suitable for use in high-performance computing applications, as well as for advanced communication systems.
The XC6VCX130T-2FFG484I is designed to be scalable and upgradable, making it an ideal choice for applications that require flexibility and customization. It is designed to be able to handle complex tasks, such as real-time signal processing, embedded system development, and image processing. It is also capable of handling high-speed data transfer, making it suitable for high-performance communication systems.
The XC6VCX130T-2FFG484I is also designed to be used in advanced communication systems, such as 5G networks and beyond. It is capable of providing high-speed data transfer and is suitable for applications such as cloud computing, edge computing, and the Internet of Things (IoT). The chip model is also suitable for intelligent applications such as machine learning, artificial intelligence (AI), and natural language processing (NLP).
The XC6VCX130T-2FFG484I is also designed to be used in the era of fully intelligent systems. It is capable of providing high-performance processing for advanced AI and NLP applications, as well as providing high-speed data transfer for cloud computing and edge computing applications. With its scalability and upgradability, the chip model is suitable for use in a wide range of applications, from high-performance digital signal processing to advanced communication systems.
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2,228 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $798.9072 | $798.9072 |
| 10+ | $790.3168 | $7,903.1680 |
| 100+ | $747.3648 | $74,736.4800 |
| 1000+ | $704.4128 | $352,206.4000 |
| 10000+ | $644.2800 | $644,280.0000 |
| The price is for reference only, please refer to the actual quotation! | ||