AMD Xilinx
XC6VCX130T-2FFG484C
XC6VCX130T-2FFG484C ECAD Model
XC6VCX130T-2FFG484C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 240 | |
| Number of Outputs | 240 | |
| Number of Logic Cells | 128000 | |
| Number of CLBs | 10000 | |
| Combinatorial Delay of a CLB-Max | 910 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5,2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 3 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 23 X 23 MM, LEAD FREE, FBGA-484 | |
| Pin Count | 484 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC6VCX130T-2FFG484C Datasheet Download
XC6VCX130T-2FFG484C Overview
The XC6VCX130T-2FFG484C chip model is a high-end model developed by Xilinx, Inc. It is a field-programmable gate array (FPGA) device, featuring a high-performance, low-power, and low-cost design. With its versatile architecture and advanced features, the XC6VCX130T-2FFG484C chip model is suitable for a wide variety of applications, from consumer electronics to industrial automation.
The original design intention of the XC6VCX130T-2FFG484C chip model is to be a versatile, low-cost FPGA device for a wide range of applications. It is designed to offer high performance, low power consumption, and cost-effectiveness. The device is capable of being upgraded to support more advanced features, making it suitable for use in more demanding applications.
The XC6VCX130T-2FFG484C chip model is suitable for a wide range of applications, including advanced communication systems. It is capable of supporting a variety of communication protocols, including Ethernet, Wi-Fi, Bluetooth, and Zigbee. It also supports a wide range of intelligent scenarios, such as machine learning, artificial intelligence, and natural language processing. The device is also capable of being used in fully intelligent systems, making it suitable for use in the era of fully intelligent systems.
The product description and specific design requirements of the XC6VCX130T-2FFG484C chip model can be found in the Xilinx product datasheet. The product datasheet outlines the device's features and specifications, including its operating temperature range, power requirements, and memory capacity. It also provides information on the device's power management capabilities, as well as its compatibility with various communication protocols.
In addition to the product datasheet, actual case studies and precautions should also be taken into consideration when using the XC6VCX130T-2FFG484C chip model. Case studies can provide valuable insight into how the device performs in real-world scenarios, while precautions can help to ensure that the device is used safely and efficiently. When using the device, users should always follow the manufacturer's instructions and safety precautions. Additionally, users should regularly check for updates and patches to ensure that the device is running the most up-to-date software.
The XC6VCX130T-2FFG484C chip model is a versatile, low-cost FPGA device that is suitable for a wide range of applications, from consumer electronics to industrial automation. It is capable of being upgraded to support more advanced features, making it suitable for use in more demanding applications. It is also capable of being used in advanced communication systems, as well as a variety of intelligent scenarios. By following the manufacturer's instructions and safety precautions, as well as regularly checking for updates and patches, users can ensure that the device is used safely and efficiently.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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