XC6SLX9-N3FTG256C

The XC6SLX9-N3FTG256C is a Field Programmable Gate Array (FPGA) chip manufactured by Xilinx. It is based on the Spartan-6 family of FPGAs and is designed for high-performance, low-power applications. It has a total of 256,000 logic cells and a maximum of 1,536 Kbits of block RAM. The chip has two primary I/O banks and four secondary I/O banks, allowing for a total of 192 I/O pins. It has an operating temperature range of -40°C to +85°C and is packaged in a 256-pin, fine-pitch BGA package.

The XC6SLX9-N3FTG256C is designed for use in a variety of applications, including wireless communications, automotive, industrial, medical, and consumer electronics. It features a wide range of advanced features, such as high-speed transceivers, high-speed SERDES, and a range of I/O standards. It also supports multiple clock domains and has extensive clock management capabilities.

The chip is designed to meet the needs of a wide range of applications, including high-speed data acquisition and processing, video and image processing, high-speed networking, and embedded systems. It is also suitable for applications that require low power consumption, such as mobile devices and IoT applications. The chip is highly configurable and can be used in a variety of designs. It is also compatible with a range of development tools, including Xilinx’s Vivado Design Suite.