XC6SLX9-3FTG256C

The XC6SLX9-3FTG256C is a Field Programmable Gate Array (FPGA) chip manufactured by Xilinx. It is a mid-range device from the Spartan 6 family, and it is designed for cost-sensitive applications. It features an array of 256K logic cells, and is capable of up to 4.5 million system gates. It also contains 6.4Mbits of block RAM, and over 400 18x18 multipliers.

The XC6SLX9-3FTG256C is a low-power device that operates at a maximum of 1.2V. It has a typical power consumption of 2.7W, and a maximum of 4.5W. It also supports a wide range of I/O standards, including LVDS, LVPECL and SSTL. It is packaged in a 256-pin Flip-Chip Ball Grid Array (FCBGA) package, with a thermal dissipation of 11.5W.

The XC6SLX9-3FTG256C is suitable for a wide range of applications, including embedded systems, video and imaging, industrial control and automation, high-speed networking, and aerospace and defense. It is also suitable for applications in automotive, medical, and consumer markets.

The XC6SLX9-3FTG256C is a powerful and cost-effective FPGA chip that is suitable for a wide range of applications. It offers high performance, low power consumption, and a wide range of I/O standards. It is also packaged in a compact FCBGA package, making it ideal for space-constrained applications.