XC6SLX9-3CPG196C

The XC6SLX9-3CPG196C is a low-cost, low-power field-programmable gate array (FPGA) chip model produced by Xilinx. It is designed for high-performance applications in the aerospace, defense, automotive, industrial, and medical industries.

The XC6SLX9-3CPG196C FPGA chip model features a 6-input look-up table (LUT) architecture, with 6,144 logic cells, and a maximum operating frequency of up to 250 MHz. It also contains up to 1,536 kbits of embedded block RAM, as well as up to 8,192 flip-flops. The device also includes up to 4,096 configurable I/Os, and up to 8 DSP slices.

The XC6SLX9-3CPG196C chip model is manufactured using a 0.13-micron CMOS process, and is packaged in a 676-ball BGA package. It has a power dissipation of 1.9 W and an operating temperature range of -40°C to +85°C.

The XC6SLX9-3CPG196C FPGA chip model is suitable for use in a wide range of applications, including aerospace and defense, automotive, industrial, medical, and other high-performance applications. It can be used to design high-speed digital signal processing (DSP) systems, high-speed serial communication networks, and high-performance embedded systems. The device can also be used to develop high-performance application-specific integrated circuits (ASICs) and system-on-chip (SoC) designs.