XC6SLX75T-N3FGG676C

The XC6SLX75T-N3FGG676C is a field-programmable gate array (FPGA) chip manufactured by Xilinx, Inc. It is based on the Spartan-6 family of FPGAs and is built on the 45nm low-power process. It has a total of 675K logic cells, 2.9Mb of block RAM, and 4,096 DSP slices. The chip also has two high-speed transceivers, two high-speed serial transceivers, and two high-speed clock management tiles. The chip is designed to provide high performance, low power, and low cost.

The XC6SLX75T-N3FGG676C has a maximum power consumption of 9.3W. Its operating temperature range is from -40°C to 85°C. It is a 7x7mm, 676-pin flip-chip ball grid array package. The chip has a total of 8,192 I/O pins and supports a wide range of I/O standards, including LVDS, LVCMOS, and SSTL.

The XC6SLX75T-N3FGG676C can be used in a variety of applications, such as embedded systems, video processing, communications, and industrial control. It can be used to create custom logic designs, as well as to implement complex algorithms. It is also suitable for high-speed data acquisition and signal processing. The chip supports various development tools, such as Xilinx ISE, Xilinx Vivado, and Xilinx PlanAhead, which make it easier to design and deploy FPGA-based applications.