AMD Xilinx
XC6SLX75T-3FG676C
XC6SLX75T-3FG676C ECAD Model
XC6SLX75T-3FG676C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 320 | |
| Number of Outputs | 320 | |
| Number of Logic Cells | 74637 | |
| Number of CLBs | 5831 | |
| Combinatorial Delay of a CLB-Max | 210 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 5831 CLBS | |
| Clock Frequency-Max | 862 MHz | |
| Power Supplies | 1.2,2.5/3.3 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.44 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 27 X 27 MM, 1 MM PITCH, FBGA-676 | |
| Pin Count | 676 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
XC6SLX75T-3FG676C Datasheet Download
XC6SLX75T-3FG676C Overview
The XC6SLX75T-3FG676C chip model is a powerful and versatile device that is designed for high-performance digital signal processing, embedded processing, and image processing. It is a Field Programmable Gate Array (FPGA) device, meaning that it can be programmed using HDL (Hardware Description Language) to perform a variety of tasks. The original design intention of the chip model was to provide a platform for the development of complex digital signal processing and embedded processing applications, as well as image processing.
The chip model is highly scalable, which means that it can be easily upgraded to support more complex applications. For example, it can be used to develop and popularize future intelligent robots, as it is capable of supporting a wide range of tasks. The chip model can also be used to develop advanced communication systems, such as wireless networks and cellular networks.
In order to use the chip model effectively, certain technical talents are required. For example, the user must have a good understanding of HDL and be able to program the chip model using this language. Furthermore, the user must also have a good understanding of digital signal processing and embedded processing, as well as image processing.
Overall, the XC6SLX75T-3FG676C chip model is a powerful and versatile device that can be used for a wide range of applications, including high-performance digital signal processing, embedded processing, image processing, and more. It is highly scalable and can be easily upgraded to support more complex applications. In order to use the chip model effectively, certain technical talents are required, such as a good understanding of HDL and digital signal processing.
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1,964 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $279.4799 | $279.4799 |
| 10+ | $276.4747 | $2,764.7472 |
| 100+ | $261.4489 | $26,144.8920 |
| 1000+ | $246.4231 | $123,211.5600 |
| 10000+ | $225.3870 | $225,387.0000 |
| The price is for reference only, please refer to the actual quotation! | ||