
AMD Xilinx
XC6SLX75T-3FG484C
XC6SLX75T-3FG484C ECAD Model
XC6SLX75T-3FG484C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 268 | |
Number of Outputs | 268 | |
Number of Logic Cells | 74637 | |
Number of CLBs | 5831 | |
Combinatorial Delay of a CLB-Max | 210 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 5831 CLBS | |
Clock Frequency-Max | 862 MHz | |
Power Supplies | 1.2,2.5/3.3 V | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
JESD-30 Code | S-PBGA-B484 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 484 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA484,22X22,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 23 mm | |
Length | 23 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 23 X 23 MM, 1 MM PITCH, FBGA-484 | |
Pin Count | 484 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A991.D |
XC6SLX75T-3FG484C Datasheet Download
XC6SLX75T-3FG484C Overview
The chip model XC6SLX75T-3FG484C is a high-performance FPGA designed by Xilinx, Inc. It is a low-cost, low-power, and high-performance FPGA for embedded applications. It is based on the Xilinx Spartan-6 LX family architecture, which provides high-density logic and routing resources for embedded applications. The chip model XC6SLX75T-3FG484C has a variety of features, including high-speed transceivers, embedded memory, and advanced I/O.
The original design intention of the chip model XC6SLX75T-3FG484C was to provide an efficient and low-cost solution for embedded applications. It is designed to meet the requirements of modern embedded systems, such as high-speed transceivers, embedded memory, and advanced I/O. Furthermore, it is also designed to be easily upgradable and customizable to meet the needs of future applications.
The chip model XC6SLX75T-3FG484C is suitable for a wide range of applications, including communication systems, automotive systems, industrial control systems, and medical systems. It is capable of providing high-speed data transmission, low-power operation, and advanced I/O capabilities.
The chip model XC6SLX75T-3FG484C can be used in advanced communication systems, such as 5G, Wi-Fi 6, and LTE networks. It is also suitable for intelligent scenarios, such as autonomous vehicles, smart cities, and the Internet of Things (IoT). It is also able to be used in the era of fully intelligent systems, such as artificial intelligence (AI) and machine learning (ML).
The product description of the chip model XC6SLX75T-3FG484C includes the following features: low-cost, low-power, high-performance FPGA; high-speed transceivers; embedded memory; and advanced I/O. It also includes design considerations, such as power consumption, signal integrity, and system integration.
When designing with the chip model XC6SLX75T-3FG484C, it is important to consider the system requirements and the design limitations. It is also important to consider the power consumption, signal integrity, and system integration of the design. Furthermore, actual case studies should be consulted for best practices and precautions when designing with the chip model XC6SLX75T-3FG484C.
In conclusion, the chip model XC6SLX75T-3FG484C is a low-cost, low-power, and high-performance FPGA designed by Xilinx, Inc. It is suitable for a wide range of applications, including communication systems, automotive systems, industrial control systems, and medical systems. It is capable of providing high-speed data transmission, low-power operation, and advanced I/O capabilities. Furthermore, it is designed to be easily upgradable and customizable to meet the needs of future applications.
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1,077 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $121.8672 | $121.8672 |
10+ | $120.5568 | $1,205.5680 |
100+ | $114.0048 | $11,400.4800 |
1000+ | $107.4528 | $53,726.4000 |
10000+ | $98.2800 | $98,280.0000 |
The price is for reference only, please refer to the actual quotation! |