XC6SLX75T-2FGG676C

The XC6SLX75T-2FGG676C is a Field Programmable Gate Array (FPGA) chip from Xilinx. It is manufactured using a 65nm low-power process and is available in a 676-pin Flip-Chip Ball Grid Array (FCBGA) package. The chip has a total of 75,000 logic cells and a total of 676 I/Os, with support for up to 8 banks of DDR3 memory. It also has two clock management tiles, two power management tiles, and a hard IP core.

The FPGA is designed to provide high performance and low power consumption, making it suitable for a wide range of applications. It is ideal for system-level designs such as embedded systems, digital signal processing, and communications. It supports a wide range of peripherals, including Ethernet, Serial RapidIO, PCI Express, and USB. It also supports multiple high-speed transceivers, with up to 28.5 Gbps of bandwidth.

The XC6SLX75T-2FGG676C also features a wide range of features, including advanced power management, enhanced security, and advanced debugging capabilities. It also has support for Xilinx's Vivado Design Suite, which allows for easy design and implementation of complex systems.

Overall, the XC6SLX75T-2FGG676C is a powerful and versatile FPGA chip, with a wide range of features and applications. It is suitable for a wide range of applications, from embedded systems to high-speed communications. It is an ideal choice for designers looking for a powerful and reliable FPGA solution.