AMD Xilinx
XC6SLX75T-2FG676C
XC6SLX75T-2FG676C ECAD Model
XC6SLX75T-2FG676C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 320 | |
| Number of Outputs | 320 | |
| Number of Logic Cells | 74637 | |
| Number of CLBs | 5831 | |
| Combinatorial Delay of a CLB-Max | 260 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 5831 CLBS | |
| Clock Frequency-Max | 667 MHz | |
| Power Supplies | 1.2,2.5/3.3 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.44 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | 27 X 27 MM, 1 MM PITCH, FBGA-676 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Pin Count | 676 |
XC6SLX75T-2FG676C Datasheet Download
XC6SLX75T-2FG676C Overview
The XC6SLX75T-2FG676C chip model is a powerful and versatile device that is well-suited to a variety of applications. It is designed for high-performance digital signal processing, embedded processing, image processing, and other related tasks that require the use of HDL language. This chip model offers numerous advantages that make it a popular choice for these types of applications.
The XC6SLX75T-2FG676C chip model is designed to provide superior performance in terms of both speed and efficiency. It features a high-speed 6-stage pipeline architecture and a low-power design that enables it to process data quickly and efficiently. Additionally, the chip model is equipped with a wide range of features including a variety of configurable I/O, memory, and debug options. This makes it easy to customize the device to meet the specific needs of any application.
The XC6SLX75T-2FG676C chip model also offers a number of advantages over traditional microprocessors and digital signal processors. It is designed to be highly reliable, with a long life cycle, and it is capable of handling complex tasks with ease. Additionally, the chip model is designed to be highly flexible, allowing for easy integration into existing systems and the ability to adapt to changing requirements.
The XC6SLX75T-2FG676C chip model is expected to be in high demand in the future as more applications require high-performance digital signal processing, embedded processing, image processing, and other related tasks. The chip model's original design intention was to provide superior performance and efficiency, and its flexibility and reliability make it an ideal choice for a variety of applications. Additionally, the chip model is capable of being upgraded to support more advanced communication systems, making it a viable option for future applications.
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5,310 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $129.6048 | $129.6048 |
| 10+ | $128.2112 | $1,282.1120 |
| 100+ | $121.2432 | $12,124.3200 |
| 1000+ | $114.2752 | $57,137.6000 |
| 10000+ | $104.5200 | $104,520.0000 |
| The price is for reference only, please refer to the actual quotation! | ||