XC6SLX75-N3FGG676C

The XC6SLX75-N3FGG676C is a field programmable gate array (FPGA) chip manufactured by Xilinx. It is a member of the Spartan-6 family and is designed to be used in high-performance applications. It is a low-cost, low-power, high-performance FPGA with advanced features and capabilities.

The XC6SLX75-N3FGG676C is a 675-ball BGA package with a 6.5 x 8 mm body size. It has a maximum power of 4.7 W, a maximum operating temperature of 85°C and a maximum operating frequency of 300 MHz. It features 6,840 logic cells, 5,824 flip-flops, 3,936 Kbits of embedded RAM, 4,096 multipliers, and a total of 5,040 user I/Os. It also includes an integrated digital clock manager (DCM), which provides the highest level of clock management and control.

The XC6SLX75-N3FGG676C is suitable for a wide range of applications, including industrial automation, machine vision, automotive and medical imaging, aerospace and defense, and consumer electronics. It is also suitable for high-speed signal processing, communications, networking, and embedded systems. It is ideal for applications that require low power, high performance, and small form factor.

In summary, the XC6SLX75-N3FGG676C is a low-cost, low-power, high-performance FPGA with advanced features and capabilities. It is suitable for a wide range of applications, including industrial automation, machine vision, automotive and medical imaging, aerospace and defense, and consumer electronics. It is ideal for applications that require low power, high performance, and small form factor.