AMD Xilinx
XC6SLX75-L1FG484C
XC6SLX75-L1FG484C ECAD Model
XC6SLX75-L1FG484C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 280 | |
| Number of Outputs | 280 | |
| Number of Logic Cells | 74637 | |
| Number of CLBs | 5831 | |
| Combinatorial Delay of a CLB-Max | 460 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 5831 CLBS | |
| Power Supplies | 1,2.5/3.3 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 23 X 23 MM, 1 MM PITCH, FBGA-484 | |
| Pin Count | 484 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC6SLX75-L1FG484C Datasheet Download
XC6SLX75-L1FG484C Overview
XC6SLX75-L1FG484C is an advanced chip model that is designed for high-performance digital signal processing, embedded processing, and image processing. It is capable of providing an impressive level of performance and efficiency. The chip model is based on the latest Xilinx Spartan-6 FPGA architecture and is capable of providing a wide range of features, such as high-speed signal processing, low power consumption, and advanced reconfigurable logic.
The chip model XC6SLX75-L1FG484C has several advantages over traditional chips. For example, it is capable of providing higher performance and efficiency, as well as being more cost-effective. Furthermore, it is also capable of providing a wide range of features, such as high-speed signal processing, low power consumption, and advanced reconfigurable logic. This makes it an ideal choice for a variety of applications.
In the future, the demand for XC6SLX75-L1FG484C is expected to rise significantly in the digital signal processing, embedded processing, and image processing industries. This is due to its wide range of features and its cost-effectiveness. Furthermore, the chip model is also expected to be used in a variety of network applications, such as 5G networks, as well as intelligent scenarios such as IoT and AI. As the technology of the chip model continues to evolve, it is likely to be used in more sophisticated applications, such as fully intelligent systems.
In conclusion, the XC6SLX75-L1FG484C is a powerful chip model that is ideal for high-performance digital signal processing, embedded processing, and image processing. It has several advantages over traditional chips, such as higher performance, efficiency, and cost-effectiveness. Furthermore, it is expected to be used in a variety of network applications as well as intelligent scenarios in the future. As the technology of the chip model continues to evolve, it is likely to be used in more sophisticated applications, such as fully intelligent systems.
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3,398 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $140.1808 | $140.1808 |
| 10+ | $138.6734 | $1,386.7344 |
| 100+ | $131.1368 | $13,113.6840 |
| 1000+ | $123.6002 | $61,800.1200 |
| 10000+ | $113.0490 | $113,049.0000 |
| The price is for reference only, please refer to the actual quotation! | ||