XC6SLX75-3CSG324C
XC6SLX75-3CSG324C
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AMD Xilinx

XC6SLX75-3CSG324C


XC6SLX75-3CSG324C
F20-XC6SLX75-3CSG324C
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XC6SLX75-3CSG324C ECAD Model


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XC6SLX75-3CSG324C Attributes


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XC6SLX75-3CSG324C Overview



The XC6SLX75-3CSG324C chip model is a high-performance, low-power FPGA (Field Programmable Gate Array) that is suitable for a variety of applications including high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with HDL (Hardware Description Language) language to enable users to create their own logic circuits.


The XC6SLX75-3CSG324C chip model is designed with a number of advantages that make it an ideal choice for a wide range of applications. It offers high-speed performance, low power consumption, and flexibility in terms of design. It also has a wide range of I/O options and can be used with a variety of different interfaces. The chip model also features an advanced programmable logic array (PLA) core, which allows for the implementation of complex algorithms and functions.


In terms of future demand, the XC6SLX75-3CSG324C chip model is likely to remain popular in a variety of industries due to its flexible design and high-performance capabilities. It is expected to be used in a variety of applications such as medical imaging, automotive systems, and industrial automation. Additionally, its low power consumption and flexibility make it an attractive option for a variety of embedded systems.


The original design intention of the XC6SLX75-3CSG324C chip model was to provide users with a powerful and flexible platform for creating their own logic circuits. It was designed to be used with HDL language, which allows users to create their own logic circuits without needing to learn a lot of complex programming languages. The chip model is also designed to be upgradeable, allowing users to add new features and functions as they become available. This makes it an ideal choice for a variety of applications and allows users to create more complex logic circuits.


Finally, the XC6SLX75-3CSG324C chip model is designed to be used in advanced communication systems. It is capable of supporting a wide range of different interfaces, including Ethernet, USB, and Wi-Fi. Additionally, it is capable of supporting a variety of different protocols, making it an ideal choice for a variety of communication systems. As such, it is expected to remain popular in the future and is likely to be used in a variety of new and innovative applications.



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