XC6SLX75-2FGG676I

The XC6SLX75-2FGG676I chip model is a Field Programmable Gate Array (FPGA) from Xilinx. It is a member of the Spartan 6 family of FPGAs, and is designed for applications where low power consumption and small form factor are important. The chip is built on a 65nm process technology, and has a total of 6,144 logic cells and 8,192 embedded memory blocks. It also includes two dedicated multipliers, two dedicated DSP slices, and two dedicated I/O blocks.

The chip has a total of 676 user I/O pins, with 12 high-speed serial transceiver blocks, and four Clock Management Tiles. It also includes two dedicated power-down control signals, and two dedicated configuration pins. The operating voltage range is from 1.2V to 3.3V, with a maximum power consumption of 3.2W. The chip is available in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package, with a 0.8mm ball pitch, and a maximum operating temperature of 85 degrees Celsius.

The XC6SLX75-2FGG676I chip is suitable for a wide range of applications, including industrial automation, digital signal processing, embedded systems, and communications. It is also suitable for use in high-performance computing, video processing, and imaging systems. The chip is also well-suited for use in automotive, aerospace, and medical applications.