
AMD Xilinx
XC6SLX75-2FG676C
XC6SLX75-2FG676C ECAD Model
XC6SLX75-2FG676C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 400 | |
Number of Outputs | 400 | |
Number of Logic Cells | 74637 | |
Number of CLBs | 5831 | |
Combinatorial Delay of a CLB-Max | 260 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 5831 CLBS | |
Clock Frequency-Max | 667 MHz | |
Power Supplies | 1.2,2.5/3.3 V | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
JESD-30 Code | S-PBGA-B676 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 676 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA676,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.44 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 27 X 27 MM, 1 MM PITCH, FBGA-676 | |
Pin Count | 676 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC6SLX75-2FG676C Datasheet Download
XC6SLX75-2FG676C Overview
The XC6SLX75-2FG676C chip model is a revolutionary new product that has the potential to revolutionize the way that networks are used. It is a powerful and flexible chip that can be used in a variety of applications, from communications to data processing and more. This chip model is designed to be used in a wide range of scenarios, from small networks to larger, more complex systems.
The chip model XC6SLX75-2FG676C is an excellent choice for applications that require high performance, low power consumption, and high reliability. It is also designed for easy integration into existing networks and systems, allowing for seamless integration with existing systems and networks. The chip model is also designed to be compatible with a variety of new technologies, allowing for more complex applications to be developed.
In terms of industry trends, the XC6SLX75-2FG676C chip model is a great choice for applications that require the latest technologies. It is designed to be compatible with a variety of new technologies, including 5G, artificial intelligence, and machine learning. This makes it a great choice for applications that require the latest technologies and the ability to quickly adapt to new trends and developments.
In terms of its potential applications, the XC6SLX75-2FG676C chip model is a great choice for applications that require high performance, low power consumption, and high reliability. It is also designed for easy integration into existing networks and systems, allowing for seamless integration with existing systems and networks. This makes it a great choice for applications that require the latest technologies and the ability to quickly adapt to new trends and developments.
In terms of product description and specific design requirements, the XC6SLX75-2FG676C chip model is designed to meet the needs of a variety of applications. It is designed to be compatible with a variety of new technologies, including 5G, artificial intelligence, and machine learning. It also has a variety of features, such as high speed data transfer, low power consumption, and high reliability.
In terms of actual case studies and precautions, the XC6SLX75-2FG676C chip model is a great choice for applications that require the latest technologies and the ability to quickly adapt to new trends and developments. It is also designed to be compatible with a variety of new technologies, including 5G, artificial intelligence, and machine learning. It is also designed for easy integration into existing networks and systems, allowing for seamless integration with existing systems and networks.
Overall, the XC6SLX75-2FG676C chip model is a great choice for applications that require the latest technologies and the ability to quickly adapt to new trends and developments. It is designed to be compatible with a variety of new technologies, including 5G, artificial intelligence, and machine learning. It also has a variety of features, such as high speed data transfer, low power consumption, and high reliability. It is also designed for easy integration into existing networks and systems, allowing for seamless integration with existing systems and networks. This makes it a great choice for applications that require the latest technologies and the ability to quickly adapt to new trends and developments.
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1,263 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $170.1599 | $170.1599 |
10+ | $168.3302 | $1,683.3019 |
100+ | $159.1818 | $15,918.1812 |
1000+ | $150.0334 | $75,016.7160 |
10000+ | $137.2257 | $137,225.7000 |
The price is for reference only, please refer to the actual quotation! |