XC6SLX75-2FG676C
XC6SLX75-2FG676C
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rohs

AMD Xilinx

XC6SLX75-2FG676C


XC6SLX75-2FG676C
F20-XC6SLX75-2FG676C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 27 X 27 MM, 1 MM PITCH, FBGA-676
27 X 27 MM, 1 MM PITCH, FBGA-676

XC6SLX75-2FG676C ECAD Model


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XC6SLX75-2FG676C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1.2 V
Number of Inputs 400
Number of Outputs 400
Number of Logic Cells 74637
Number of CLBs 5831
Combinatorial Delay of a CLB-Max 260 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 5831 CLBS
Clock Frequency-Max 667 MHz
Power Supplies 1.2,2.5/3.3 V
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
JESD-30 Code S-PBGA-B676
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 676
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.44 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 27 X 27 MM, 1 MM PITCH, FBGA-676
Pin Count 676
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC6SLX75-2FG676C Datasheet Download


XC6SLX75-2FG676C Overview



The XC6SLX75-2FG676C chip model is a revolutionary new product that has the potential to revolutionize the way that networks are used. It is a powerful and flexible chip that can be used in a variety of applications, from communications to data processing and more. This chip model is designed to be used in a wide range of scenarios, from small networks to larger, more complex systems.


The chip model XC6SLX75-2FG676C is an excellent choice for applications that require high performance, low power consumption, and high reliability. It is also designed for easy integration into existing networks and systems, allowing for seamless integration with existing systems and networks. The chip model is also designed to be compatible with a variety of new technologies, allowing for more complex applications to be developed.


In terms of industry trends, the XC6SLX75-2FG676C chip model is a great choice for applications that require the latest technologies. It is designed to be compatible with a variety of new technologies, including 5G, artificial intelligence, and machine learning. This makes it a great choice for applications that require the latest technologies and the ability to quickly adapt to new trends and developments.


In terms of its potential applications, the XC6SLX75-2FG676C chip model is a great choice for applications that require high performance, low power consumption, and high reliability. It is also designed for easy integration into existing networks and systems, allowing for seamless integration with existing systems and networks. This makes it a great choice for applications that require the latest technologies and the ability to quickly adapt to new trends and developments.


In terms of product description and specific design requirements, the XC6SLX75-2FG676C chip model is designed to meet the needs of a variety of applications. It is designed to be compatible with a variety of new technologies, including 5G, artificial intelligence, and machine learning. It also has a variety of features, such as high speed data transfer, low power consumption, and high reliability.


In terms of actual case studies and precautions, the XC6SLX75-2FG676C chip model is a great choice for applications that require the latest technologies and the ability to quickly adapt to new trends and developments. It is also designed to be compatible with a variety of new technologies, including 5G, artificial intelligence, and machine learning. It is also designed for easy integration into existing networks and systems, allowing for seamless integration with existing systems and networks.


Overall, the XC6SLX75-2FG676C chip model is a great choice for applications that require the latest technologies and the ability to quickly adapt to new trends and developments. It is designed to be compatible with a variety of new technologies, including 5G, artificial intelligence, and machine learning. It also has a variety of features, such as high speed data transfer, low power consumption, and high reliability. It is also designed for easy integration into existing networks and systems, allowing for seamless integration with existing systems and networks. This makes it a great choice for applications that require the latest technologies and the ability to quickly adapt to new trends and developments.



1,263 In Stock


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Unit Price: $182.9676
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $170.1599 $170.1599
10+ $168.3302 $1,683.3019
100+ $159.1818 $15,918.1812
1000+ $150.0334 $75,016.7160
10000+ $137.2257 $137,225.7000
The price is for reference only, please refer to the actual quotation!

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