AMD Xilinx
XC6SLX45-L1FG676I
XC6SLX45-L1FG676I ECAD Model
XC6SLX45-L1FG676I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 358 | |
| Number of Outputs | 358 | |
| Number of Logic Cells | 43661 | |
| Number of CLBs | 3411 | |
| Combinatorial Delay of a CLB-Max | 460 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3411 CLBS | |
| Power Supplies | 1,2.5/3.3 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.44 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 27 X 27 MM, 1 MM PITCH, FBGA-676 | |
| Pin Count | 676 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC6SLX45-L1FG676I Datasheet Download
XC6SLX45-L1FG676I Overview
The XC6SLX45-L1FG676I chip model is an advanced integrated circuit solution that offers a variety of benefits to its users. It is designed to be used in networks and intelligent scenarios, and can be used in the era of fully intelligent systems. This chip model is a powerful tool for developing and popularizing future intelligent robots.
The XC6SLX45-L1FG676I chip model has a wide range of features that make it a great choice for network and intelligent solutions. It is designed with a low power consumption, high performance, and a low cost per unit. It also has a wide range of features that make it suitable for a variety of applications, including high-speed data processing, wireless communication, and data storage.
The product description of the XC6SLX45-L1FG676I chip model includes features such as its low power consumption, high performance, and low cost per unit. It also includes the details of its design, such as its architecture, the type of processor used, and the memory size. Additionally, it provides information on the different types of software and hardware that can be used with the chip model.
The XC6SLX45-L1FG676I chip model has been used in a variety of case studies. For example, it has been used in the development of a wireless communication system, a distributed computing system, and a data storage system. Additionally, it has been used to develop a high-speed data processing system and a control system for robots.
When using the XC6SLX45-L1FG676I chip model, it is important to take certain precautions. It is important to ensure that the chip model is compatible with the system it is being used in, and that it is not damaged in any way. Additionally, it is important to ensure that the software and hardware used with the chip model are up to date and compatible with the chip model.
The XC6SLX45-L1FG676I chip model can be used in the development and popularization of future intelligent robots. It can be used to create complex robotic systems that can perform tasks autonomously. It can also be used to create robots that can interact with their environment and respond to commands. To use the XC6SLX45-L1FG676I chip model effectively, it is important to have a good understanding of computer science, electronics, and robotics. Additionally, it is important to have experience in programming and software engineering.
In conclusion, the XC6SLX45-L1FG676I chip model is a powerful tool for developing and popularizing future intelligent robots. It is designed with a low power consumption, high performance, and low cost per unit. Additionally, it has been used in a variety of case studies and can be used to create complex robotic systems. To use the XC6SLX45-L1FG676I chip model effectively, it is important to have a good understanding of computer science, electronics, and robotics, as well as experience in programming and software engineering.
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2,146 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $89.0047 | $89.0047 |
| 10+ | $88.0477 | $880.4768 |
| 100+ | $83.2625 | $8,326.2480 |
| 1000+ | $78.4773 | $39,238.6400 |
| 10000+ | $71.7780 | $71,778.0000 |
| The price is for reference only, please refer to the actual quotation! | ||