XC6SLX45-2FGG676I

The XC6SLX45-2FGG676I is a Field Programmable Gate Array (FPGA) chip from Xilinx. It is a mid-range device that features 45,000 logic cells, 676 I/Os, and 1.5 Mbits of block RAM. The FPGA has a maximum clock frequency of 200 MHz and a power dissipation of 4.2 W.

The XC6SLX45-2FGG676I is ideal for applications requiring high performance, low power and low cost. It can be used in a wide range of applications such as embedded systems, communications, industrial automation, medical imaging, and automotive systems. It is also well suited for applications that require high speed data acquisition, processing, and control such as motor control, digital signal processing, and image processing.

The chip is designed to be used with the Xilinx Vivado Design Suite, which provides a comprehensive set of tools for designing, developing, and debugging FPGA designs. It is also compatible with the Xilinx ISE Design Suite, which includes a suite of tools for designing, debugging, and verifying FPGA designs.

The XC6SLX45-2FGG676I has an operating temperature range of -40°C to +85°C and is packaged in a 676-pin Fine-Pitch Ball Grid Array (FBGA). It is available in both commercial and industrial temperature grade versions. The chip is RoHS compliant and has a wide range of safety certifications. It is also backed by a limited lifetime warranty.