XC6SLX45-2FGG676C

The XC6SLX45-2FGG676C is a Field Programmable Gate Array (FPGA) chip model from Xilinx. It is a low-cost, low-power FPGA with a capacity of 45,000 logic cells. It is based on the 6th generation of the Xilinx Spartan-6 FPGA architecture. The chip features 676 I/O pins and a maximum clock frequency of 200 MHz. It has a power dissipation of 1.5 W and a maximum operating temperature of 85°C.

The XC6SLX45-2FGG676C is suitable for a wide range of applications, such as embedded control, image and video processing, automotive, industrial automation, medical imaging, and communications systems. It is also suitable for high-speed serial connectivity and high-speed memory interfaces. The chip supports multiple I/O standards, such as LVDS, LVCMOS, and PCI Express. It also supports multiple power domains, such as core and I/O power domains.

The chip has a number of features that make it suitable for a variety of applications. It supports low-cost and low-power designs, and its 676 I/O pins provide a high degree of flexibility for system design. It also has a wide range of configurable logic blocks, allowing for the implementation of complex designs. It also has a high-speed transceiver block, which supports data rates up to 5 Gbps. Additionally, the chip has a built-in clock management unit, which allows for the implementation of high-speed clock distribution networks.

Overall, the XC6SLX45-2FGG676C is a low-cost, low-power FPGA with a capacity of 45,000 logic cells and 676 I/O pins. It is suitable for a wide range of applications, such as embedded control, image and video processing, automotive, industrial automation, medical imaging, and communications systems. It has a number of features that make it suitable for a variety of applications, such as low-cost and low-power designs, configurable logic blocks, and a high-speed transceiver block.