XC6SLX25-2FGG484I

The XC6SLX25-2FGG484I is a Field Programmable Gate Array (FPGA) chip from Xilinx. It is a mid-range device in the Spartan-6 family of FPGAs and is based on the 45nm low-power process technology. This chip has an array of 6,000 logic cells and is capable of supporting up to 5.5 million system gates. It also has an integrated 10/100/1000 Mbps Ethernet MAC and an integrated PCI Express Gen2 endpoint.

The XC6SLX25-2FGG484I has a maximum operating temperature of 85°C and a maximum operating voltage of 1.2V. It also has a maximum power dissipation of 6.7W, and a minimum power dissipation of 0.75W. The chip is packaged in a 484-pin Flip-Chip Ball Grid Array (FCBGA) package and has a total of 4,800 I/Os. It also has two banks of 4,800 user I/Os, which can be used to drive various peripherals like SRAMs, DDR2/3, QDR II/II+ SRAMs, and LVDS.

The XC6SLX25-2FGG484I can be used for a variety of applications, such as embedded systems, industrial automation, aerospace and defense, automotive, medical imaging, and consumer electronics. It is also suitable for high-speed serial designs, such as Gigabit Ethernet, PCI Express, and Serial RapidIO. The chip can also be used for high-speed digital signal processing, image processing, and video processing. With its low-power and high-performance capabilities, the XC6SLX25-2FGG484I is an ideal choice for many applications.