
AMD Xilinx
XC6SLX150T-N3FG676I
XC6SLX150T-N3FG676I ECAD Model
XC6SLX150T-N3FG676I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 396 | |
Number of Outputs | 396 | |
Number of Logic Cells | 147443 | |
Number of CLBs | 11519 | |
Combinatorial Delay of a CLB-Max | 260 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 11519 CLBS | |
Clock Frequency-Max | 806 MHz | |
Power Supplies | 1.2,1.2/3.3,2.5/3.3 V | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
JESD-30 Code | S-PBGA-B676 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 676 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA676,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.44 mm | |
Ihs Manufacturer | XILINX INC | |
Package Description | 27 X 27 MM, 1 MM PITCH, FBGA-676 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC6SLX150T-N3FG676I Datasheet Download
XC6SLX150T-N3FG676I Overview
The XC6SLX150T-N3FG676I chip model is a powerful and versatile integrated circuit designed for a wide range of applications. Developed by Xilinx, this model is designed to provide high-performance, low-power solutions for a variety of applications. It features high-speed processing, low power consumption, and configurable logic blocks and routing resources that can be tailored to any specific application.
The XC6SLX150T-N3FG676I chip model offers a number of advantages to users. It is highly reliable, with a long service life and low failure rate. It also provides high-speed and low-power processing, with the ability to handle multiple tasks simultaneously. Additionally, it is configurable, allowing users to customize the chip model to their specific needs.
The XC6SLX150T-N3FG676I chip model is expected to be in high demand in the future, as it is well-suited for a variety of applications. It is well-suited for use in industrial automation, medical devices, automotive systems, and communications systems. Additionally, it is expected to be used in a variety of intelligent systems, such as home automation, robotics, and AI-based systems.
The XC6SLX150T-N3FG676I chip model is designed to be upgradeable, allowing users to easily add new features and capabilities. This makes it well-suited for use in advanced communication systems, as it can easily be adapted to meet changing requirements. Additionally, it is expected to be used in the era of fully intelligent systems, as it can be used to power a wide variety of intelligent scenarios.
Overall, the XC6SLX150T-N3FG676I chip model is a powerful and versatile integrated circuit that offers a number of advantages to users. It is highly reliable, with a long service life and low failure rate. Additionally, it is configurable, allowing users to customize the chip model to their specific needs. It is expected to be in high demand in the future, as it is well-suited for a variety of applications. Finally, it is designed to be upgradeable, allowing users to easily add new features and capabilities.
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2,290 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $242.7672 | $242.7672 |
10+ | $240.1568 | $2,401.5680 |
100+ | $227.1048 | $22,710.4800 |
1000+ | $214.0528 | $107,026.4000 |
10000+ | $195.7800 | $195,780.0000 |
The price is for reference only, please refer to the actual quotation! |