XC6SLX150T-2FGG900C

The XC6SLX150T-2FGG900C is a Field Programmable Gate Array (FPGA) chip manufactured by Xilinx. It is based on the Virtex-6 FPGA family and is suitable for a wide range of applications, including high-performance computing, embedded systems, and digital signal processing.

The chip has a total of 150,000 logic cells and 1,536 digital signal processing (DSP) slices. It features 1.5 million system gates, 1.2 million RAM bits, and 6,000 I/O pins. It has an operating temperature range of 0°C to 85°C and a maximum power dissipation of 22 watts. The chip is available in a 900-pin flip-chip ball grid array (FCBGA) package.

The XC6SLX150T-2FGG900C is suitable for a variety of applications, including high-speed networking, wireless communications, video and image processing, and digital signal processing. It offers high-performance computing capabilities, low power consumption, and high levels of integration. It supports a wide range of protocols, including Ethernet, USB, PCI Express, and Serial RapidIO.

The XC6SLX150T-2FGG900C is an ideal choice for designers looking for a high-performance, low-cost FPGA solution. It is suitable for a variety of applications, including embedded systems, high-speed networking, wireless communications, and digital signal processing. It offers high levels of integration and low power consumption, making it an ideal choice for a wide range of applications.