XC6SLX150T-2FG900C
XC6SLX150T-2FG900C
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XC6SLX150T-2FG900C


XC6SLX150T-2FG900C
F20-XC6SLX150T-2FG900C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 31 X 31 MM, 1 MM PITCH, BGA-900
31 X 31 MM, 1 MM PITCH, BGA-900

XC6SLX150T-2FG900C ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

XC6SLX150T-2FG900C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1.2 V
Number of Inputs 530
Number of Outputs 530
Number of Logic Cells 147443
Number of CLBs 11519
Combinatorial Delay of a CLB-Max 260 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 11519 CLBS
Clock Frequency-Max 667 MHz
Power Supplies 1.2,2.5/3.3 V
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
JESD-30 Code S-PBGA-B900
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 900
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA900,30X30,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 31 mm
Length 31 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Package Description 31 X 31 MM, 1 MM PITCH, BGA-900
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01
Part Package Code BGA
Pin Count 900

XC6SLX150T-2FG900C Datasheet Download


XC6SLX150T-2FG900C Overview



The Xilinx XC6SLX150T-2FG900C is a field programmable gate array (FPGA) chip designed for high-end applications. It is a high-performance, cost-effective solution for advanced communication systems and other demanding applications. The chip model is built on a 28-nm process technology, making it one of the most powerful FPGAs available on the market.


The XC6SLX150T-2FG900C is designed to provide a rich set of features, including high-speed I/O, high-speed memory, high-speed clock management, and low-power design capability. It also supports a wide range of protocols, such as PCI Express, Ethernet, and USB. The chip model has a total of 1.5 million logic cells, which can be used to implement complex designs. It also offers a wide range of configurable options, such as clock management, I/O, and memory, which can be used to customize the chip to meet specific design requirements.


The XC6SLX150T-2FG900C is also capable of supporting future upgrades and can be used in the development and popularization of intelligent robots. It can be used to create robots that can interact with the environment and respond to commands. To use the XC6SLX150T-2FG900C effectively, engineers need to have a good understanding of the chip model and its capabilities. They should also be familiar with the programming language used to program the chip, such as Verilog or VHDL.


When designing a system with the XC6SLX150T-2FG900C, engineers should take into account the chip's power consumption and heat dissipation requirements. The power consumption of the chip should be kept within the specified limits, and the heat dissipation should be adequate for the environment in which the system is used. Additionally, engineers should ensure that the system is designed to meet the specific requirements of the application.


In conclusion, the XC6SLX150T-2FG900C is a powerful and cost-effective FPGA chip designed for high-end applications. It is capable of supporting future upgrades and can be used in the development and popularization of intelligent robots. To use the chip model effectively, engineers need to have a good understanding of the chip model and its capabilities and be familiar with the programming language used to program the chip. Additionally, they should ensure that the system is designed to meet the specific requirements of the application and take into account the chip's power consumption and heat dissipation requirements.



3,208 In Stock


I want to buy

Unit Price: $261.04
The price is for reference only.
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
1+ $242.7672 $242.7672
10+ $240.1568 $2,401.5680
100+ $227.1048 $22,710.4800
1000+ $214.0528 $107,026.4000
10000+ $195.7800 $195,780.0000
The price is for reference only, please refer to the actual quotation!

Quick Quote