
AMD Xilinx
XC6SLX150-N3FGG484I
XC6SLX150-N3FGG484I ECAD Model
XC6SLX150-N3FGG484I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 338 | |
Number of Outputs | 338 | |
Number of Logic Cells | 147443 | |
Number of CLBs | 11519 | |
Combinatorial Delay of a CLB-Max | 260 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 11519 CLBS | |
Clock Frequency-Max | 806 MHz | |
Power Supplies | 1.2,1.2/3.3,2.5/3.3 V | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
JESD-30 Code | S-PBGA-B484 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 484 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA484,22X22,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 23 mm | |
Length | 23 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | XILINX INC | |
Package Description | 23 X 23 MM, 1 MM PITCH, LEAD FREE, FBGA-484 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC6SLX150-N3FGG484I Datasheet Download
XC6SLX150-N3FGG484I Overview
The chip model XC6SLX150-N3FGG484I is a high-performance programmable logic device designed to meet the needs of the most demanding applications. It is a highly integrated device that offers a wide range of features and functions, including high-speed serial transceivers, high-speed I/O, high-performance memory, and advanced system integration capabilities. With its advanced features and functions, the XC6SLX150-N3FGG484I chip model is well-suited for a variety of applications, from high-speed communications to embedded systems.
The chip model XC6SLX150-N3FGG484I is expected to be widely used in the future. As technology advances, the need for more powerful, flexible, and efficient devices increases. The XC6SLX150-N3FGG484I chip model is designed to meet these demands and provide reliable performance in the most challenging environments.
The chip model XC6SLX150-N3FGG484I is expected to be used in networks and intelligent scenarios in the future. By leveraging its advanced features and functions, the chip model can be used to develop and popularize future intelligent robots. With its high-speed serial transceivers and high-speed I/O, the XC6SLX150-N3FGG484I chip model can be used to create fully intelligent systems.
In order to effectively use the XC6SLX150-N3FGG484I chip model, technical talents with a deep understanding of the technology are needed. They should have knowledge of embedded systems, high-speed communications, and system integration capabilities. Additionally, they should be familiar with the latest industry trends and be able to identify the best solutions for the application environment.
In conclusion, the XC6SLX150-N3FGG484I chip model is expected to be widely used in the future. With its advanced features and functions, the chip model can be used in networks and intelligent scenarios, as well as in the development and popularization of future intelligent robots. In order to use the chip model effectively, technical talents with a deep understanding of the technology are needed.
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3,898 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $217.7651 | $217.7651 |
10+ | $215.4235 | $2,154.2352 |
100+ | $203.7157 | $20,371.5720 |
1000+ | $192.0079 | $96,003.9600 |
10000+ | $175.6170 | $175,617.0000 |
The price is for reference only, please refer to the actual quotation! |