XC6SLX150-N3FG676I
XC6SLX150-N3FG676I
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rohs

AMD Xilinx

XC6SLX150-N3FG676I


XC6SLX150-N3FG676I
F20-XC6SLX150-N3FG676I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 27 X 27 MM, 1 MM PITCH, FBGA-676
27 X 27 MM, 1 MM PITCH, FBGA-676

XC6SLX150-N3FG676I ECAD Model


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XC6SLX150-N3FG676I Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1.2 V
Number of Inputs 498
Number of Outputs 498
Number of Logic Cells 147443
Number of CLBs 11519
Combinatorial Delay of a CLB-Max 260 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology CMOS
Organization 11519 CLBS
Clock Frequency-Max 806 MHz
Power Supplies 1.2,1.2/3.3,2.5/3.3 V
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
JESD-30 Code S-PBGA-B676
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 676
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.44 mm
Ihs Manufacturer XILINX INC
Package Description 27 X 27 MM, 1 MM PITCH, FBGA-676
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC6SLX150-N3FG676I Datasheet Download


XC6SLX150-N3FG676I Overview



The XC6SLX150-N3FG676I chip model is a powerful and versatile device that is suitable for a variety of applications. It is used for high-performance digital signal processing, embedded processing, image processing, and other tasks. To make the most of the chip, it requires the use of HDL language.


The XC6SLX150-N3FG676I chip model provides a number of advantages over other models. It is designed to be highly efficient, with low power consumption and high performance. It also has a small form factor that makes it suitable for a wide range of applications. Additionally, the chip model is designed to be highly reliable and robust, making it a great choice for long-term use.


The demand for the XC6SLX150-N3FG676I chip model is expected to grow in the future. This is due to its versatility and the range of applications it can be used for. As more applications are developed that require high-performance digital signal processing, embedded processing, and image processing, the demand for the chip model is likely to increase.


The product description of the XC6SLX150-N3FG676I chip model includes its features, specifications, and design requirements. It is important to understand these features and specifications in order to make the most of the chip. Additionally, it is important to understand the design requirements in order to create an effective and efficient design.


When designing with the XC6SLX150-N3FG676I chip model, it is important to consider actual case studies and precautions. Case studies can provide valuable insights into how the chip model can be used in a variety of applications. Additionally, it is important to take precautions when using the chip model, as it is a powerful and versatile device that can be easily misused.


In conclusion, the XC6SLX150-N3FG676I chip model is a powerful and versatile device that is suitable for a variety of applications. It provides a number of advantages over other models, and its demand is expected to grow in the future. It is important to understand the product description and design requirements of the chip model, along with actual case studies and precautions, in order to make the most of the chip.



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Unit Price: $218.40
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Pricing (USD)

QTY Unit Price Ext Price
1+ $203.1120 $203.1120
10+ $200.9280 $2,009.2800
100+ $190.0080 $19,000.8000
1000+ $179.0880 $89,544.0000
10000+ $163.8000 $163,800.0000
The price is for reference only, please refer to the actual quotation!

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