AMD Xilinx
XC6SLX150-N3FG676C
XC6SLX150-N3FG676C ECAD Model
XC6SLX150-N3FG676C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 498 | |
| Number of Outputs | 498 | |
| Number of Logic Cells | 147443 | |
| Number of CLBs | 11519 | |
| Combinatorial Delay of a CLB-Max | 260 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 11519 CLBS | |
| Clock Frequency-Max | 806 MHz | |
| Power Supplies | 1.2,1.2/3.3,2.5/3.3 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.44 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | 27 X 27 MM, 1 MM PITCH, FBGA-676 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
XC6SLX150-N3FG676C Datasheet Download
XC6SLX150-N3FG676C Overview
The XC6SLX150-N3FG676C is an advanced chip model developed by Xilinx. It is a Field Programmable Gate Array (FPGA) device that is designed to provide a high level of programmability and flexibility for embedded systems. This model is designed to meet the needs of a wide range of applications, including networking, communication, and digital signal processing.
The XC6SLX150-N3FG676C chip model is a low-cost, high-performance solution for embedded systems. It has a wide range of features, including a high-speed serial transceiver, a large number of configurable logic blocks, and a high-performance memory interface. In addition, it features a wide variety of I/O options, including LVDS, PCI Express, and USB.
The original design intention of the XC6SLX150-N3FG676C was to provide a flexible and cost-effective solution for embedded systems. Its wide range of features and I/O options make it suitable for a variety of applications, including networking, communication, and digital signal processing. It also has the potential to be upgraded to meet the needs of future applications.
In terms of its application to advanced communication systems, the XC6SLX150-N3FG676C can be used to build high-speed networks and communications systems. It features a high-speed serial transceiver, which can be used to send and receive data at speeds up to 10 Gbps. It also has a wide range of configurable logic blocks, which can be used to implement complex communication protocols.
The XC6SLX150-N3FG676C chip model can also be used in the development and popularization of future intelligent robots. It can be used to build robots with sophisticated sensing capabilities and advanced motor control. It also has a wide range of configurable logic blocks, which can be used to implement complex algorithms and control systems.
In order to use the XC6SLX150-N3FG676C chip model effectively, it is important to understand its design and features. It is also important to be aware of the precautions that need to be taken when using the model, such as avoiding overloading the logic blocks, and ensuring that the I/O options are compatible with the target system. In addition, it is important to have a good understanding of the programming languages used to program the chip, such as Verilog and VHDL.
In conclusion, the XC6SLX150-N3FG676C chip model is a powerful and flexible solution for embedded systems. It has the potential to be upgraded to meet the needs of future applications, and can be used to build high-speed networks, advanced communication systems, and intelligent robots. In order to use the model effectively, it is important to understand its design and features, as well as the precautions that need to be taken when using it.
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3,491 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $250.3858 | $250.3858 |
| 10+ | $247.6934 | $2,476.9344 |
| 100+ | $234.2318 | $23,423.1840 |
| 1000+ | $220.7702 | $110,385.1200 |
| 10000+ | $201.9240 | $201,924.0000 |
| The price is for reference only, please refer to the actual quotation! | ||