AMD Xilinx
XC6SLX150-L1FGG676C
XC6SLX150-L1FGG676C ECAD Model
XC6SLX150-L1FGG676C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 498 | |
| Number of Outputs | 498 | |
| Number of Logic Cells | 147443 | |
| Number of CLBs | 11519 | |
| Combinatorial Delay of a CLB-Max | 460 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 11519 CLBS | |
| Power Supplies | 1,2.5/3.3 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.44 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Package Description | 27 X 27 MM, 1 MM PITCH, LEAD FREE, FBGA-676 | |
| Pin Count | 676 | |
| ECCN Code | 3A991.D |
XC6SLX150-L1FGG676C Datasheet Download
XC6SLX150-L1FGG676C Overview
The chip model XC6SLX150-L1FGG676C is a FPGA chip with the latest technology, created by the Xilinx Corporation. This chip is designed to be used in a variety of applications, such as networking, artificial intelligence, robotics, and more. It is a powerful and versatile chip that can be used in many different scenarios.
As technology continues to evolve, the chip model XC6SLX150-L1FGG676C is sure to stay ahead of the curve. This chip is designed to be used in the most advanced networks, allowing for the development of more intelligent systems. In addition, this chip can be used in the development of robots and other automated machines. It is capable of supporting complex algorithms and can be used to create powerful and efficient robots.
In terms of the future development of the chip model XC6SLX150-L1FGG676C, it is likely to become even more powerful and versatile. It is expected that this chip will be able to support more advanced technologies in the future, such as artificial intelligence, machine learning, and more. This chip is also expected to be used in the development of fully intelligent robots and other automated machines.
In order to use the chip model XC6SLX150-L1FGG676C effectively, it is important to have the right technical skills. Knowledge of FPGA programming, computer engineering, and robotics is essential for those who want to use this chip to its full potential. Additionally, knowledge of artificial intelligence and machine learning is also important for those who want to use this chip to develop more advanced systems.
Overall, the chip model XC6SLX150-L1FGG676C is a powerful and versatile chip with a wide range of applications. It is capable of supporting the most advanced technologies and can be used in the development of fully intelligent systems. It is important to have the right technical skills in order to use this chip to its full potential. With the right knowledge and skills, the chip model XC6SLX150-L1FGG676C can be used to create powerful and efficient robots, networks, and other automated machines.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||