
AMD Xilinx
XC6SLX150-L1FG676C
XC6SLX150-L1FG676C ECAD Model
XC6SLX150-L1FG676C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 498 | |
Number of Outputs | 498 | |
Number of Logic Cells | 147443 | |
Number of CLBs | 11519 | |
Combinatorial Delay of a CLB-Max | 460 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 11519 CLBS | |
Power Supplies | 1,2.5/3.3 V | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B676 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 676 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA676,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.44 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 27 X 27 MM, 1 MM PITCH, FBGA-676 | |
Pin Count | 676 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A991.D |
XC6SLX150-L1FG676C Datasheet Download
XC6SLX150-L1FG676C Overview
The Xilinx XC6SLX150-L1FG676C is a Field Programmable Gate Array (FPGA) chip that has been designed to meet the needs of a variety of applications. It is a highly flexible and powerful chip that can be used for a range of tasks, including data processing, signal processing, and communication systems.
This FPGA chip is based on the Xilinx Virtex-6 LX150T FPGA architecture, which is known for its high performance and low power consumption. The chip has a maximum power consumption of just 6.76 W and a maximum operating frequency of up to 300 MHz. It also features 6,150 logic cells and other advanced features, such as a large number of I/O pins, high-speed memory interfaces, and flexible clock management.
The XC6SLX150-L1FG676C is designed to be used in a variety of applications, including communication systems, automotive applications, industrial automation, and consumer electronics. It is also highly suitable for use in high-performance computing and embedded systems. The chip is capable of providing support for a range of communication protocols, including Ethernet, USB, and PCI Express. It is also capable of providing support for a range of high-speed interfaces, such as DDR3, QDRII+, and RLDRAM.
The XC6SLX150-L1FG676C is also designed to be highly customizable, allowing users to tailor the chip to their specific needs. It is also designed to be highly scalable, allowing users to upgrade their systems as their needs change. This makes it an ideal choice for applications that need to be able to adapt to changing requirements.
When using the XC6SLX150-L1FG676C, it is important to be aware of the potential risks associated with using this chip. It is important to ensure that the chip is used in the correct environment, as it may be susceptible to damage if used in the wrong environment. It is also important to be aware of the potential for errors to occur when using this chip, as errors can lead to data loss or corruption.
In conclusion, the Xilinx XC6SLX150-L1FG676C is a powerful and highly flexible FPGA chip that is suitable for a variety of applications. It is capable of providing support for a range of communication protocols and high-speed interfaces, and it is also highly customizable and scalable. However, it is important to be aware of the potential risks associated with using this chip and to ensure that it is used in the correct environment.
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