XC6SLX150-L1FG676C
XC6SLX150-L1FG676C
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rohs

AMD Xilinx

XC6SLX150-L1FG676C


XC6SLX150-L1FG676C
F20-XC6SLX150-L1FG676C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 27 X 27 MM, 1 MM PITCH, FBGA-676
27 X 27 MM, 1 MM PITCH, FBGA-676

XC6SLX150-L1FG676C ECAD Model


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XC6SLX150-L1FG676C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1 V
Number of Inputs 498
Number of Outputs 498
Number of Logic Cells 147443
Number of CLBs 11519
Combinatorial Delay of a CLB-Max 460 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 11519 CLBS
Power Supplies 1,2.5/3.3 V
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B676
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 676
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.44 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 27 X 27 MM, 1 MM PITCH, FBGA-676
Pin Count 676
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
ECCN Code 3A991.D

XC6SLX150-L1FG676C Datasheet Download


XC6SLX150-L1FG676C Overview



The Xilinx XC6SLX150-L1FG676C is a Field Programmable Gate Array (FPGA) chip that has been designed to meet the needs of a variety of applications. It is a highly flexible and powerful chip that can be used for a range of tasks, including data processing, signal processing, and communication systems.


This FPGA chip is based on the Xilinx Virtex-6 LX150T FPGA architecture, which is known for its high performance and low power consumption. The chip has a maximum power consumption of just 6.76 W and a maximum operating frequency of up to 300 MHz. It also features 6,150 logic cells and other advanced features, such as a large number of I/O pins, high-speed memory interfaces, and flexible clock management.


The XC6SLX150-L1FG676C is designed to be used in a variety of applications, including communication systems, automotive applications, industrial automation, and consumer electronics. It is also highly suitable for use in high-performance computing and embedded systems. The chip is capable of providing support for a range of communication protocols, including Ethernet, USB, and PCI Express. It is also capable of providing support for a range of high-speed interfaces, such as DDR3, QDRII+, and RLDRAM.


The XC6SLX150-L1FG676C is also designed to be highly customizable, allowing users to tailor the chip to their specific needs. It is also designed to be highly scalable, allowing users to upgrade their systems as their needs change. This makes it an ideal choice for applications that need to be able to adapt to changing requirements.


When using the XC6SLX150-L1FG676C, it is important to be aware of the potential risks associated with using this chip. It is important to ensure that the chip is used in the correct environment, as it may be susceptible to damage if used in the wrong environment. It is also important to be aware of the potential for errors to occur when using this chip, as errors can lead to data loss or corruption.


In conclusion, the Xilinx XC6SLX150-L1FG676C is a powerful and highly flexible FPGA chip that is suitable for a variety of applications. It is capable of providing support for a range of communication protocols and high-speed interfaces, and it is also highly customizable and scalable. However, it is important to be aware of the potential risks associated with using this chip and to ensure that it is used in the correct environment.



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