XC6SLX150-2FG900C
XC6SLX150-2FG900C
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AMD Xilinx

XC6SLX150-2FG900C


XC6SLX150-2FG900C
F20-XC6SLX150-2FG900C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 31 X 31 MM, 1 MM PITCH, BGA-900
31 X 31 MM, 1 MM PITCH, BGA-900

XC6SLX150-2FG900C ECAD Model


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XC6SLX150-2FG900C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1.2 V
Number of Inputs 570
Number of Outputs 570
Number of Logic Cells 147443
Number of CLBs 11519
Combinatorial Delay of a CLB-Max 260 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 11519 CLBS
Clock Frequency-Max 667 MHz
Power Supplies 1.2,2.5/3.3 V
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
JESD-30 Code S-PBGA-B900
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 900
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA900,30X30,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 31 mm
Length 31 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 31 X 31 MM, 1 MM PITCH, BGA-900
Pin Count 900
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC6SLX150-2FG900C Datasheet Download


XC6SLX150-2FG900C Overview



The XC6SLX150-2FG900C chip model is a cutting-edge product developed by Xilinx Inc. It is designed to provide an advanced, low-power, and high-performance FPGA solution for a wide range of applications. The chip model has a wide range of features, including a high-speed, low-latency memory architecture, a large number of logic cells, and a high-speed I/O interface. It also has advanced features such as built-in error correction and detection, and a low-power design.


The XC6SLX150-2FG900C chip model is capable of handling a wide range of applications, including communication systems, networks, and intelligent scenarios. It can be used in the development and popularization of future intelligent robots, and can be used in the era of fully intelligent systems. It has the potential to be used for advanced communication systems, as it has a wide range of features that allow for high-speed and low-latency communication.


The XC6SLX150-2FG900C chip model is capable of being upgraded in the future and can be used in a variety of intelligent scenarios. It can be used for the development of intelligent robots and the popularization of intelligent systems. The chip model can be used in the development of intelligent systems, such as autonomous vehicles, and can be used for the development of artificial intelligence and machine learning applications. To use the XC6SLX150-2FG900C chip model effectively, technical talents such as software engineers and hardware engineers are needed.


In conclusion, the XC6SLX150-2FG900C chip model is a cutting-edge product developed by Xilinx Inc. It is designed to provide an advanced, low-power, and high-performance FPGA solution for a wide range of applications. It has the potential to be used for advanced communication systems, as it has a wide range of features that allow for high-speed and low-latency communication. It can be used in the development and popularization of future intelligent robots, and can be used in the era of fully intelligent systems. To use the XC6SLX150-2FG900C chip model effectively, technical talents such as software engineers and hardware engineers are needed.



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Unit Price: $218.40
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Pricing (USD)

QTY Unit Price Ext Price
1+ $203.1120 $203.1120
10+ $200.9280 $2,009.2800
100+ $190.0080 $19,000.8000
1000+ $179.0880 $89,544.0000
10000+ $163.8000 $163,800.0000
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