
AMD Xilinx
XC6SLX100T-3FG900C
XC6SLX100T-3FG900C ECAD Model
XC6SLX100T-3FG900C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 490 | |
Number of Outputs | 490 | |
Number of Logic Cells | 101261 | |
Number of CLBs | 7911 | |
Combinatorial Delay of a CLB-Max | 210 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 7911 CLBS | |
Clock Frequency-Max | 862 MHz | |
Power Supplies | 1.2,2.5/3.3 V | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
JESD-30 Code | S-PBGA-B900 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 900 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA900,30X30,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 31 mm | |
Length | 31 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 31 X 31 MM, 1 MM PITCH, BGA-900 | |
Pin Count | 900 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC6SLX100T-3FG900C Datasheet Download
XC6SLX100T-3FG900C Overview
The Xilinx XC6SLX100T-3FG900C chip model is a highly advanced integrated circuit (IC) designed for a variety of applications. It is a member of the Spartan-6 family and is capable of a wide range of functions, including high-speed signal processing, digital logic, and complex mathematical operations. It is also able to be used in a variety of communication systems, such as wireless networks, cellular networks, and satellite networks.
The original design intention of the XC6SLX100T-3FG900C was to provide a highly integrated system-on-chip (SoC) solution for a wide range of applications. It was designed to provide a high-performance, low-cost solution for a variety of applications, including embedded systems, consumer electronics, and communications systems. The chip has a wide range of features, such as a high-speed signal processing engine, a high-speed digital logic engine, and a high-speed memory interface. It also has a range of peripheral interfaces, including USB, Ethernet, and serial communication.
The XC6SLX100T-3FG900C is a highly versatile chip and can be used in a variety of applications. It is capable of being used in advanced communication systems, such as high-speed wireless networks, cellular networks, and satellite networks. It can also be used in intelligent scenarios, such as machine learning and artificial intelligence. The chip is also capable of being used in the era of fully intelligent systems, such as autonomous vehicles and smart homes.
In terms of product description, the XC6SLX100T-3FG900C is a low-power, high-performance SoC with a range of features. It has a high-speed signal processing engine, a high-speed digital logic engine, and a high-speed memory interface. It also has a range of peripheral interfaces, including USB, Ethernet, and serial communication. The chip is also capable of being used in a variety of applications, including embedded systems, consumer electronics, and communication systems.
The XC6SLX100T-3FG900C is a highly advanced chip and can be used in a variety of applications. However, it is important to note that the chip is not suitable for all applications. It is important to consider the specific design requirements of the application before selecting the chip. It is also important to consider the power requirements of the application and the environmental conditions in which the chip will be used. Additionally, it is important to consider the cost of the chip and the availability of support services.
To conclude, the XC6SLX100T-3FG900C is a highly advanced chip model designed for a wide range of applications, including embedded systems, consumer electronics, and communication systems. It is capable of being used in advanced communication systems and intelligent scenarios, such as machine learning and artificial intelligence. However, it is important to consider the specific design requirements of the application, the power requirements, the environmental conditions, and the cost of the chip before selecting it.
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5,039 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $196.3416 | $196.3416 |
10+ | $194.2304 | $1,942.3040 |
100+ | $183.6744 | $18,367.4400 |
1000+ | $173.1184 | $86,559.2000 |
10000+ | $158.3400 | $158,340.0000 |
The price is for reference only, please refer to the actual quotation! |