XC6SLX100T-3FG900C
XC6SLX100T-3FG900C
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rohs

AMD Xilinx

XC6SLX100T-3FG900C


XC6SLX100T-3FG900C
F20-XC6SLX100T-3FG900C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 31 X 31 MM, 1 MM PITCH, BGA-900
31 X 31 MM, 1 MM PITCH, BGA-900

XC6SLX100T-3FG900C ECAD Model


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XC6SLX100T-3FG900C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1.2 V
Number of Inputs 490
Number of Outputs 490
Number of Logic Cells 101261
Number of CLBs 7911
Combinatorial Delay of a CLB-Max 210 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 7911 CLBS
Clock Frequency-Max 862 MHz
Power Supplies 1.2,2.5/3.3 V
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
JESD-30 Code S-PBGA-B900
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 900
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA900,30X30,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 31 mm
Length 31 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 31 X 31 MM, 1 MM PITCH, BGA-900
Pin Count 900
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC6SLX100T-3FG900C Datasheet Download


XC6SLX100T-3FG900C Overview



The Xilinx XC6SLX100T-3FG900C chip model is a highly advanced integrated circuit (IC) designed for a variety of applications. It is a member of the Spartan-6 family and is capable of a wide range of functions, including high-speed signal processing, digital logic, and complex mathematical operations. It is also able to be used in a variety of communication systems, such as wireless networks, cellular networks, and satellite networks.


The original design intention of the XC6SLX100T-3FG900C was to provide a highly integrated system-on-chip (SoC) solution for a wide range of applications. It was designed to provide a high-performance, low-cost solution for a variety of applications, including embedded systems, consumer electronics, and communications systems. The chip has a wide range of features, such as a high-speed signal processing engine, a high-speed digital logic engine, and a high-speed memory interface. It also has a range of peripheral interfaces, including USB, Ethernet, and serial communication.


The XC6SLX100T-3FG900C is a highly versatile chip and can be used in a variety of applications. It is capable of being used in advanced communication systems, such as high-speed wireless networks, cellular networks, and satellite networks. It can also be used in intelligent scenarios, such as machine learning and artificial intelligence. The chip is also capable of being used in the era of fully intelligent systems, such as autonomous vehicles and smart homes.


In terms of product description, the XC6SLX100T-3FG900C is a low-power, high-performance SoC with a range of features. It has a high-speed signal processing engine, a high-speed digital logic engine, and a high-speed memory interface. It also has a range of peripheral interfaces, including USB, Ethernet, and serial communication. The chip is also capable of being used in a variety of applications, including embedded systems, consumer electronics, and communication systems.


The XC6SLX100T-3FG900C is a highly advanced chip and can be used in a variety of applications. However, it is important to note that the chip is not suitable for all applications. It is important to consider the specific design requirements of the application before selecting the chip. It is also important to consider the power requirements of the application and the environmental conditions in which the chip will be used. Additionally, it is important to consider the cost of the chip and the availability of support services.


To conclude, the XC6SLX100T-3FG900C is a highly advanced chip model designed for a wide range of applications, including embedded systems, consumer electronics, and communication systems. It is capable of being used in advanced communication systems and intelligent scenarios, such as machine learning and artificial intelligence. However, it is important to consider the specific design requirements of the application, the power requirements, the environmental conditions, and the cost of the chip before selecting it.



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Pricing (USD)

QTY Unit Price Ext Price
1+ $196.3416 $196.3416
10+ $194.2304 $1,942.3040
100+ $183.6744 $18,367.4400
1000+ $173.1184 $86,559.2000
10000+ $158.3400 $158,340.0000
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