
AMD Xilinx
XC6SLX100T-3FG676C
XC6SLX100T-3FG676C ECAD Model
XC6SLX100T-3FG676C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 376 | |
Number of Outputs | 376 | |
Number of Logic Cells | 101261 | |
Number of CLBs | 7911 | |
Combinatorial Delay of a CLB-Max | 210 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 7911 CLBS | |
Clock Frequency-Max | 862 MHz | |
Power Supplies | 1.2,2.5/3.3 V | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
JESD-30 Code | S-PBGA-B676 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 676 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA676,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.44 mm | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
Part Package Code | BGA | |
Package Description | 27 X 27 MM, 1 MM PITCH, FBGA-676 | |
Pin Count | 676 | |
ECCN Code | 3A991.D |
XC6SLX100T-3FG676C Datasheet Download
XC6SLX100T-3FG676C Overview
The XC6SLX100T-3FG676C chip model is a highly advanced and powerful FPGA chip designed by Xilinx. It is one of the most sought-after chips in the industry due to its wide range of features and capabilities. The chip is designed with a 6-layer logic cell array, which allows it to provide high-speed performance and low power consumption. It also features a wide range of I/O options, including high-speed serial transceivers and LVDS I/O, making it an ideal choice for various applications.
The chip model XC6SLX100T-3FG676C has a number of advantages that make it highly attractive to the industry. It offers high-speed performance, low power consumption, and a wide range of I/O options. Additionally, the chip is designed with a 6-layer logic cell array, which allows for efficient routing of signals and data. This makes it a great choice for applications that require high-speed performance and low power consumption.
The demand for the XC6SLX100T-3FG676C chip model is expected to remain strong in the coming years, as the chip is well suited to a variety of applications. It can be used in communication systems, networks, and other intelligent scenarios. It is also well suited for the era of fully intelligent systems, as its 6-layer logic cell array allows for efficient routing of signals and data.
The original design intention of the XC6SLX100T-3FG676C chip model was to provide a reliable and powerful solution for various applications. The chip was designed with a 6-layer logic cell array, which allows for efficient routing of signals and data. Additionally, the chip is capable of providing high-speed performance and low power consumption.
The XC6SLX100T-3FG676C chip model is capable of being upgraded in the future. This could include the addition of new features, such as high-speed serial transceivers and LVDS I/O. This would make the chip even more attractive to the industry, as it would be capable of handling more complex tasks.
In conclusion, the XC6SLX100T-3FG676C chip model is a highly advanced and powerful FPGA chip designed by Xilinx. It offers a wide range of features and capabilities, including high-speed performance, low power consumption, and a wide range of I/O options. The chip is also capable of being upgraded in the future, making it an ideal choice for various applications. The chip is expected to remain in high demand in the coming years, as it is well suited to a variety of applications, including communication systems, networks, and other intelligent scenarios. Additionally, it is well suited for the era of fully intelligent systems, as its 6-layer logic cell array allows for efficient routing of signals and data.
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5,127 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $170.2272 | $170.2272 |
10+ | $168.3968 | $1,683.9680 |
100+ | $159.2448 | $15,924.4800 |
1000+ | $150.0928 | $75,046.4000 |
10000+ | $137.2800 | $137,280.0000 |
The price is for reference only, please refer to the actual quotation! |