XC6SLX100T-3FG676C
XC6SLX100T-3FG676C
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rohs

AMD Xilinx

XC6SLX100T-3FG676C


XC6SLX100T-3FG676C
F20-XC6SLX100T-3FG676C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 27 X 27 MM, 1 MM PITCH, FBGA-676
27 X 27 MM, 1 MM PITCH, FBGA-676

XC6SLX100T-3FG676C ECAD Model


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XC6SLX100T-3FG676C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1.2 V
Number of Inputs 376
Number of Outputs 376
Number of Logic Cells 101261
Number of CLBs 7911
Combinatorial Delay of a CLB-Max 210 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 7911 CLBS
Clock Frequency-Max 862 MHz
Power Supplies 1.2,2.5/3.3 V
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
JESD-30 Code S-PBGA-B676
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 676
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.44 mm
Ihs Manufacturer XILINX INC
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
Part Package Code BGA
Package Description 27 X 27 MM, 1 MM PITCH, FBGA-676
Pin Count 676
ECCN Code 3A991.D

XC6SLX100T-3FG676C Datasheet Download


XC6SLX100T-3FG676C Overview



The XC6SLX100T-3FG676C chip model is a highly advanced and powerful FPGA chip designed by Xilinx. It is one of the most sought-after chips in the industry due to its wide range of features and capabilities. The chip is designed with a 6-layer logic cell array, which allows it to provide high-speed performance and low power consumption. It also features a wide range of I/O options, including high-speed serial transceivers and LVDS I/O, making it an ideal choice for various applications.


The chip model XC6SLX100T-3FG676C has a number of advantages that make it highly attractive to the industry. It offers high-speed performance, low power consumption, and a wide range of I/O options. Additionally, the chip is designed with a 6-layer logic cell array, which allows for efficient routing of signals and data. This makes it a great choice for applications that require high-speed performance and low power consumption.


The demand for the XC6SLX100T-3FG676C chip model is expected to remain strong in the coming years, as the chip is well suited to a variety of applications. It can be used in communication systems, networks, and other intelligent scenarios. It is also well suited for the era of fully intelligent systems, as its 6-layer logic cell array allows for efficient routing of signals and data.


The original design intention of the XC6SLX100T-3FG676C chip model was to provide a reliable and powerful solution for various applications. The chip was designed with a 6-layer logic cell array, which allows for efficient routing of signals and data. Additionally, the chip is capable of providing high-speed performance and low power consumption.


The XC6SLX100T-3FG676C chip model is capable of being upgraded in the future. This could include the addition of new features, such as high-speed serial transceivers and LVDS I/O. This would make the chip even more attractive to the industry, as it would be capable of handling more complex tasks.


In conclusion, the XC6SLX100T-3FG676C chip model is a highly advanced and powerful FPGA chip designed by Xilinx. It offers a wide range of features and capabilities, including high-speed performance, low power consumption, and a wide range of I/O options. The chip is also capable of being upgraded in the future, making it an ideal choice for various applications. The chip is expected to remain in high demand in the coming years, as it is well suited to a variety of applications, including communication systems, networks, and other intelligent scenarios. Additionally, it is well suited for the era of fully intelligent systems, as its 6-layer logic cell array allows for efficient routing of signals and data.



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Unit Price: $183.04
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Pricing (USD)

QTY Unit Price Ext Price
1+ $170.2272 $170.2272
10+ $168.3968 $1,683.9680
100+ $159.2448 $15,924.4800
1000+ $150.0928 $75,046.4000
10000+ $137.2800 $137,280.0000
The price is for reference only, please refer to the actual quotation!

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