XC6SLX100T-2FG900I

The XC6SLX100T-2FG900I is a Field Programmable Gate Array (FPGA) manufactured by Xilinx. It is based on the Virtex-6 LXT family of FPGAs, which are designed for high-performance applications such as imaging, video, and communications. The device has a total of 100,000 logic cells, 1,400 DSP slices, and 900 I/O pins. It is fabricated using a low-cost, low-power 65-nm process technology.

The device comes in a flip-chip ball grid array (FCBGA) package with a total of 900 pins. It has an operating temperature range of 0°C to 85°C and a maximum junction temperature of 105°C. It has a maximum power dissipation of 22.5W and a maximum clock frequency of 300 MHz. It also features advanced features such as embedded memory blocks, high-speed serial transceivers, and powerful clock management.

The XC6SLX100T-2FG900I is suitable for a wide range of applications such as embedded systems, high-speed networking, video and imaging, and medical imaging. It is also used in automotive, aerospace, and defense applications. It is also suitable for data centers and high-performance computing applications. It is designed to meet the requirements of high-speed and high-performance applications. It also offers a high level of integration, which enables designers to reduce the overall system cost.